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PCF8578HT/1,518

NXP Semiconductors

PCF8578HT/1,518 by NXP Semiconductors

PCF8578HT/1,518 by NXP Semiconductors is a 64-terminal IC with 32 backplanes and segments. Operating at -40 to 85°C, it has a supply voltage of 3/5V and consumes 0.05mA. Ideal for industrial applications requiring segment display mode in a square-shaped flatpack package.

Median Price

$1.340

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,312 parts In-Stock

1+ parts

$1.340

100+ parts

$1.310

1k+ parts

$1.290

10k+ parts

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6,312

$1.340

$1.310

$1.290

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Arrow

USA . 1,500 parts In-Stock

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Verical

USA . 1,500 parts In-Stock

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1,500

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Distributors (In-Stock)

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Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$1.271

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72

$1.271

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Digiode

USA . 4,997 parts In-Stock

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$1.273

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4,997

$1.273

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Chip Stock

USA . 3,771 parts In-Stock

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3,771

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Vyrian

USA . 2,974 parts In-Stock

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Anansix

USA . 1,747 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,781 parts In-Stock

1+ parts

$1.140

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2,781

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Corphita

USA . 3,087 parts In-Stock

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$1.206

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Argo Parts USA

USA . 1,122 parts In-Stock

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$1.271

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Netroflash

USA . 50 parts In-Stock

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$1.271

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50

$1.271

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Corohmni

South Africa . 222 parts In-Stock

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$3.125

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222

$3.125

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Microchip USA

USA . 423 parts In-Stock

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$7.290

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423

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AZTECH Wire

Italy . 302 parts In-Stock

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$17.600

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302

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Vigor

Singapore . 1,700 parts In-Stock

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$38.000

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$38.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,844 parts In-Stock

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Component Connect

USA . 7,542 parts In-Stock

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UNI Independent Distributors

Spain . 1,409 parts In-Stock

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Perfect Parts

USA . 22 parts In-Stock

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iodParts Technologies Inc.

India . 20 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 20 parts In-Stock

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20

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Overview

Enhance your electronic projects with the PCF8578HT/1,518 by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors delivers innovative solutions in the category of Other Function Interface ICs. This versatile product offers seamless integration, efficient power consumption, and a wide range of applications in various industries. Experience the value and benefits of the PCF8578HT/1,518 as it enhances performance and functionality in your projects. Unlock endless possibilities with NXP Semiconductors and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various operating conditions.

Display Mode: SEGMENT

Segment display mode allows for clear and precise visual indication, enhancing user experience.

Surface Mount: YES

Surface mount capability simplifies the assembly process and saves space on the PCB.

Package Shape: SQUARE

Square package shape is convenient for layout and design considerations in electronic applications.

Power Supplies (V): 3/5

Support for multiple power supply options allows versatility in system integration.

No. of Terminals: 64

Having 64 terminals provides connectivity for various functions and features in the IC.

Package Style (Meter): FLATPACK

Flatpack package style ensures efficient heat dissipation and ease of handling during installation.

No. of Backplanes: 32-BP

32 backplanes enable complex configuration and control in the system, enhancing functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold temperature conditions without issues.

Terminal Position: QUAD

Quad terminal position facilitates secure connection and efficient signal transmission.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance makes the IC suitable for lead-free soldering processes.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in demanding industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability in soldering connections.

Maximum Supply Current: 0.05 mA

Low maximum supply current requirement helps in energy efficiency and overall system power management.

No. of Segments: 32

32 segments allow for detailed display information and versatility in visual output.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact design and high-density integration on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Technical Specifications

Other Function Interface ICs PCF8578HT/1,518 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

JESD-30 Code:

S-PQFP-G64

Moisture Sensitivity Level (MSL):

3

No. of Backplanes:

32-BP

No. of Segments:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.05 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

PCF8578HT/1,518 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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