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PCF8562TT/2-T

NXP Semiconductors

PCF8562TT/2-T by NXP Semiconductors

PCF8562TT/2-T by NXP is a CMOS interface IC designed for segment displays, featuring 32 segments and operating b/w -40 °C to 85 °C. It supports dual terminals in a compact 48-pin package with a supply voltage of 2-6V. Ideal for industrial applications requiring reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,770 parts In-Stock

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Digiode

USA . 985 parts In-Stock

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985

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Anansix

USA . 80 parts In-Stock

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80

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One Stop Electronics

USA . 1,088 parts In-Stock

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$46.500

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UNI Independent Distributors

Spain . 3,547 parts In-Stock

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Corphita

USA . 3,521 parts In-Stock

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Overview

Unlock a world of innovation with the PCF8562TT/2-T from NXP Semiconductors, the trusted leader in advanced semiconductor solutions. This versatile interface IC offers reliable performance for diverse applications, from industrial displays to consumer electronics. With its robust design and superior temperature tolerance, it ensures optimal functionality under varying conditions. Enhance your projects with quality you can rely on—where precision meets efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Display Mode: SEGMENT

The segment display mode provides clear visibility and ease of reading, making it ideal for applications that require user interface feedback.

Surface Mount: YES

Being surface mount compatible simplifies the assembly process and saves PCB space, thereby enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular package shape allows for optimized space utilization on the PCB, making it suitable for compact designs.

Power Supplies (V): 2/5,3/6

Dual voltage supply options provide versatility in application, allowing it to integrate easily into different existing systems.

No. of Terminals: 48

With 48 terminals, the device supports a significant number of connections, enabling complex functionalities within compact designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design make it compatible with high-density applications, facilitating modern miniaturization trends.

No. of Backplanes: 4-BP

Supports 4 backplanes, which improves signal integrity and performance in multi-functionality designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding environments, making it a reliable choice for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C enhances its utility in extreme conditions, broadening its application range.

Terminal Position: DUAL

Dual terminal positioning allows easy access and better soldering, improving assembly efficiency.

Temperature Grade: INDUSTRIAL

An industrial temperature grade specifies high reliability and performance standards, suitable for professional-grade applications.

Technology: CMOS

CMOS technology offers low-power consumption and high speed, making it ideal for efficient, high-performance designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering support and are compatible with automated assembly processes, enhancing production efficiency.

Maximum Supply Current: 0.02 mA

The low maximum supply current indicates energy efficiency, which is essential for battery-operated devices.

No. of Segments: 32

A total of 32 segments offer extensive display capabilities, allowing for versatile designs and information representation.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables tighter layouts and contributes to smaller overall product designs, essential for compact applications.

Technical Specifications

Other Function Interface ICs PCF8562TT/2-T attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PDSO-G48

No. of Backplanes:

4-BP

No. of Segments:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/5,3/6

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.02 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

PCF8562TT/2-T Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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