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PCF8576DT/2-T

NXP Semiconductors

PCF8576DT/2-T by NXP Semiconductors

PCF8576DT/2-T by NXP is a CMOS segment display driver with 40 segments and operates b/w -40 °C to 85 °C. It features a compact 56-terminal, dual-position design for surface mounting. Ideal for industrial applications requiring low power (0.02 mA) and reliable performance.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 4,149 parts In-Stock

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Anansix

USA . 1,234 parts In-Stock

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Digiode

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Connector Distribution Corp

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Right Parts Inc.

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One Stop Electronics

USA . 240 parts In-Stock

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$10.500

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UNI Independent Distributors

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Corphita

USA . 3,230 parts In-Stock

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Overview

Elevate your designs with the PCF8576DT/2-T from NXP Semiconductors, a leader in innovation and quality. This versatile segment driver seamlessly integrates into various applications, empowering you to create stunning displays while maintaining low power consumption. With its robust industrial-grade performance, it ensures reliability in demanding environments. Trust NXP's legacy of excellence to enhance your projects, delivering superior value and long-lasting benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and makes the IC suitable for a wide range of applications.

Display Mode: SEGMENT

Segment display mode is ideal for clear, visual output, making it user-friendly for applications requiring visual feedback.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuitry, making it an efficient choice for manufacturers.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and space optimization on PCBs, ensuring a streamlined design.

Power Supplies (V): 2/5,3/6

The variety in power supply ranges provides flexibility for different applications, accommodating a wide array of power management strategies.

No. of Terminals: 56

With 56 terminals, the IC allows for complex connections, enabling advanced functionality and features.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to space-saving designs, perfect for compact and portable electronic devices.

No. of Backplanes: 4-BP

Having 4 backplanes allows for enhanced performance and functionality, ideal for multi-functional applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC is suitable for use in high-temperature environments, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in extreme cold conditions, making it robust for industrial applications.

Terminal Position: DUAL

Dual terminal position enhances connection options, ensuring better adaptability in varied application setups.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this IC is suitable for rigorous and demanding environments, ensuring durability.

Technology: CMOS

CMOS technology leads to lower power consumption and higher performance, making it an efficient choice for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring a strong and stable connection.

Maximum Supply Current: 0.02 mA

A maximum supply current of just 0.02 mA ensures efficient energy usage, which is crucial for battery-operated devices.

No. of Segments: 40

Having 40 segments allows for detailed and complex displays, enhancing the versatility of applications in which the product can be used.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm contributes to space efficiency on PCBs, allowing for denser circuit designs.

Technical Specifications

Other Function Interface ICs PCF8576DT/2-T attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PDSO-G56

No. of Backplanes:

4-BP

No. of Segments:

40

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/5,3/6

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.02 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

PCF8576DT/2-T Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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