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PCF8536BT/1,118

NXP Semiconductors

PCF8536BT/1,118 by NXP Semiconductors

PCF8536BT/1,118 by NXP Semiconductors is a 56-terminal IC with 44 segments for segment display applications. It operates at temperatures from -40 to 85°C and draws a max current of 0.13mA at 2/5V. The small outline package with gull wing terminals makes it suitable for industrial-grade interface circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,329 parts In-Stock

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Digiode

USA . 4,180 parts In-Stock

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Anansix

USA . 1,719 parts In-Stock

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Nova Conductors

Japan . 93 parts In-Stock

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Vigor

Singapore . 1,000 parts In-Stock

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$0.800

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$0.800

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Modulus Dynamics

Lithuania . 2,120 parts In-Stock

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$4.766

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Microchip USA

USA . 262 parts In-Stock

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$9.748

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AZTECH Wire

Italy . 1,149 parts In-Stock

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$10.010

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Corohmni

South Africa . 238 parts In-Stock

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$11.579

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One Stop Electronics

USA . 1,293 parts In-Stock

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$17.500

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Ampacity Inc.

Singapore . 1,242 parts In-Stock

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$34.500

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UNI Independent Distributors

Spain . 6,128 parts In-Stock

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Corphita

USA . 3,092 parts In-Stock

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Aranea Global

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Argo Parts USA

USA . 1,742 parts In-Stock

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Continental Prestige Electronics

USA . 494 parts In-Stock

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Overview

Unlock the power of seamless connectivity and stunning displays with the PCF8536BT/1,118 by NXP Semiconductors. As a leader in semiconductor innovation, NXP delivers top-quality interface ICs that are perfect for a wide range of applications. From automotive to consumer electronics, this product offers unparalleled value, efficiency, and reliability. Experience the difference with NXP Semiconductors and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various environments and handling.

Display Mode: SEGMENT

Segment display allows for clear and easy-to-read information display, essential for efficient interface communication.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to work with, fitting well into standard designs and layouts.

Power Supplies (V): 2/5

Dual power supply options provide versatility in compatibility and power requirements, making it suitable for a range of applications.

No. of Terminals: 56

With a high number of terminals, the IC offers ample connectivity options for interfacing with other electronic components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and low-profile package style saves space on the PCB, enabling efficient and compact designs.

No. of Backplanes: 8-BP

Multiple backplanes allow for versatile interface configurations, enhancing the flexibility and functionality of the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can handle demanding environments and maintain performance under adverse conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in both hot and cold environments, making it suitable for various applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and connection options, accommodating different design requirements.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for secure and reliable soldering during assembly, ensuring stable connections.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates durability and reliability under harsh industrial conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and performance of the IC.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections during soldering, ensuring stable performance in the long run.

Maximum Supply Current: 0.13 mA

Low maximum supply current consumption helps in reducing power usage and heat generation, contributing to energy efficiency.

No. of Digits/Characters: 40-CHARACTER

With a high number of characters supported, the IC can display detailed information or messages, enhancing communication capabilities.

No. of Segments: 44

Large number of segments allows for versatile display configurations and detailed information presentation, improving user experience.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact design and high-density PCB layouts, optimizing board space and enhancing connectivity options.

Interface IC Type: INTERFACE CIRCUIT

Equipped with an interface circuit, this IC facilitates communication between different parts of a system, enhancing overall functionality and usability.

Technical Specifications

Other Function Interface ICs PCF8536BT/1,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G56

Moisture Sensitivity Level (MSL):

1

No. of Backplanes:

8-BP

No. of Digits/Characters:

40-CHARACTER

No. of Segments:

44

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.13 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

PCF8536BT/1,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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