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PCF85133U/2DA/1,02

NXP Semiconductors

PCF85133U/2DA/1,02 by NXP Semiconductors

PCF85133U/2DA/1,02 by NXP Semiconductors is a CMOS interface IC designed for segment displays. It operates b/w 2-6V, supports up to 80 segments with a max temp of 85 °C and min of -40 °C, making it ideal for industrial applications. Its low supply current of 0.02 mA ensures energy efficiency.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,110 parts In-Stock

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Digiode

USA . 4,882 parts In-Stock

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4,882

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Anansix

USA . 1,435 parts In-Stock

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1,435

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Microchip USA

USA . 2,180 parts In-Stock

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$1.000

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$1.000

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One Stop Electronics

USA . 1,184 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 714 parts In-Stock

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$14.800

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714

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UNI Independent Distributors

Spain . 5,134 parts In-Stock

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Corphita

USA . 1,014 parts In-Stock

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Overview

Elevate your designs with the PCF85133U/2DA/1,02 from NXP Semiconductors, a leader in innovation. This versatile segment display controller excels in industrial applications, providing unmatched reliability in extreme temperatures. With its low power consumption and robust performance, it ensures longevity and efficiency in your projects. Trust NXP’s quality and experience to deliver superior solutions that enhance user experiences while reducing costs.

Feature Benefit Bullets

Display Mode: SEGMENT

The segment display mode is ideal for applications requiring clear and simple visual feedback, making it a great choice for various user interfaces.

Power Supplies: 2/5, 3/6 V

The flexible power supply options allow for compatibility with a wide range of systems, enhancing versatility in design.

Number of Backplanes: 4-BP

Having four backplane connections supports more comprehensive display configurations, enabling complex visualizations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is reliable for industrial applications even in hot environments.

Minimum Operating Temperature: -40 °C

The ability to function at extremely low temperatures makes this product suitable for harsh environmental conditions.

Temperature Grade: INDUSTRIAL

Engineered for industrial applications, this IC ensures reliability and longevity under demanding conditions.

Technology: CMOS

The advanced CMOS technology offers low power consumption, making this IC efficient and suitable for battery-operated devices.

Maximum Supply Current: 0.02 mA

The very low supply current helps in extending battery life and reduces heat generation, making it energy-efficient.

Number of Segments: 80

With 80 segments available, this IC provides high display resolution, allowing for detailed information to be presented clearly.

Technical Specifications

Other Function Interface ICs PCF85133U/2DA/1,02 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

No. of Backplanes:

4-BP

No. of Segments:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

2/5,3/6

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.02 mA

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCF85133U/2DA/1,02 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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