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LV5609V-MPB-E

Onsemi

LV5609V-MPB-E by Onsemi

LV5609V-MPB-E by Onsemi is a BICMOS technology IC with 20 terminals, operating at -20 to 80°C. It has a supply voltage of 3.3V and peak reflow temp of 260°C. Ideal for applications requiring small outline, shrink pitch packages in commercial extended temperature environments.

Median Price

$1.790

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 40 parts In-Stock

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$1.125

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40

$1.125

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Chip1Stop

Japan . 50 parts In-Stock

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$1.790

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50

$1.790

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Farnell

UK . 593 parts In-Stock

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$2.517

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593

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Verical

USA . 40 parts In-Stock

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Digiode

USA . 2,441 parts In-Stock

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$1.072

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Chip Stock

USA . 33,000 parts In-Stock

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Vyrian

USA . 6,757 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,308 parts In-Stock

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$1.015

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$1.015

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Corohmni

South Africa . 272 parts In-Stock

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$1.128

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AZTECH Wire

Italy . 169 parts In-Stock

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$19.790

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169

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Kulean Microsystems

USA . 7,005 parts In-Stock

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TANS Electronics

Latvia . 6,233 parts In-Stock

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SupplyDigital Components

Austria . 5,745 parts In-Stock

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Microchip USA

USA . 4,992 parts In-Stock

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Problanco Electronics

Mexico . 3,424 parts In-Stock

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UHIMA Technologies

Türkiye . 841 parts In-Stock

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841

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Continental Prestige Electronics

USA . 593 parts In-Stock

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$2.270

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593

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$2.270

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Overview

Experience seamless integration and superior performance with the LV5609V-MPB-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. The LV5609V-MPB-E falls under the category of Other Function Interface ICs, offering versatile applications for various needs. Customers can trust in the value and benefits this product brings, from its durable plastic/epoxy package body material to its reliable 3.3V power supply. Enhance your projects with the trusted technology and innovative design of Onsemi's LV5609V-MPB-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Power Supplies (V): 3.3

Operating at 3.3V makes this IC suitable for a wide range of applications and compatible with various systems.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature of 80°C, this IC can withstand elevated temperatures without compromising performance.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 ensures that the IC can withstand multiple reflow processes without degradation, increasing its reliability.

Technical Specifications

Other Function Interface ICs LV5609V-MPB-E attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV5609V-MPB-E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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