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LV5609V-TLM-E

Onsemi

LV5609V-TLM-E by Onsemi

LV5609V-TLM-E by Onsemi is a BICMOS technology IC with 20 terminals, operating at -20 to 80 °C. It has a supply voltage of 3.3V and peak reflow temp of 260°C. Ideal for applications requiring small outline surface mount packages.

Median Price

$1.510

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,242 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

$1.350

10k+ parts

$1.270

1,242

-

$1.510

$1.350

$1.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,401 parts In-Stock

1+ parts

$1.682

100+ parts

-

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-

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-

1,401

$1.682

-

-

-

Cyclops Electronics Ltd

UK . 93,086 parts In-Stock

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93,086

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Chip Stock

USA . 15,000 parts In-Stock

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15,000

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Vyrian

USA . 11,375 parts In-Stock

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11,375

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,273 parts In-Stock

1+ parts

$1.593

100+ parts

-

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1,273

$1.593

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-

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Corohmni

South Africa . 488 parts In-Stock

1+ parts

$1.770

100+ parts

-

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488

$1.770

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AZTECH Wire

Italy . 1,008 parts In-Stock

1+ parts

$15.730

100+ parts

-

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1,008

$15.730

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Component Stockers USA

USA . 619 parts In-Stock

1+ parts

$99.990

100+ parts

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619

$99.990

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Kepictronics

USA . 24,180 parts In-Stock

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24,180

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TANS Electronics

Latvia . 6,466 parts In-Stock

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6,466

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SupplyDigital Components

Austria . 5,853 parts In-Stock

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5,853

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Microchip USA

USA . 4,757 parts In-Stock

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4,757

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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Problanco Electronics

Mexico . 3,907 parts In-Stock

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3,907

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UHIMA Technologies

Türkiye . 472 parts In-Stock

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472

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Kulean Microsystems

USA . 126 parts In-Stock

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126

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Overview

Unlock new possibilities with the LV5609V-TLM-E by Onsemi, a cutting-edge Other Function Interface IC that offers unmatched quality and reliability. Designed with precision and expertise, this product is perfect for a wide range of applications. Say goodbye to limitations and hello to seamless performance with this versatile solution. Experience the value and benefits it brings to your projects, making every task easier and more efficient. Trust Onsemi to deliver excellence, trust LV5609V-TLM-E to take your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and compact installation on circuit boards.

Power Supplies (V): 3.3

Operates on a common voltage supply, making it suitable for a variety of applications.

Maximum Operating Temperature: 80 °C

Can withstand high operating temperatures without affecting performance.

Technology: BICMOS

Utilizes a combination of bipolar and CMOS technologies for optimal performance and efficiency.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, ensuring compatibility with other components in the system.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, making it suitable for various environmental conditions.

Technical Specifications

Other Function Interface ICs LV5609V-TLM-E attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV5609V-TLM-E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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