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PCA9605D,118

NXP Semiconductors

PCA9605D,118 by NXP Semiconductors

PCA9605D,118 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage of 5.5V and operating temperature range from -40 to 85°C. It features CMOS technology, GULL WING terminals, and is ideal for industrial applications requiring small outline package style and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 3,844 parts In-Stock

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Anansix

USA . 1,072 parts In-Stock

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Nova Conductors

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Digiode

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AZTECH Wire

Italy . 852 parts In-Stock

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Ampacity Inc.

Singapore . 1,340 parts In-Stock

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One Stop Electronics

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Corphita

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UNI Independent Distributors

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Kepictronics

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Overview

Unlock seamless communication and connectivity with the PCA9605D,118 by NXP Semiconductors. Crafted with precision and expertise, this interface circuit offers unparalleled quality and performance. Ideal for a wide range of applications, this small outline package is designed to enhance efficiency and reliability. Experience the benefits of reliable power supplies, dual terminal positions, and industrial-grade temperature resilience. Trust NXP Semiconductors to deliver innovative solutions that elevate your projects to new heights. Elevate your designs with the PCA9605D,118 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the interface IC, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 5.5

A power supply of 5.5V provides sufficient voltage for proper functioning of the interface IC, ensuring optimal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this interface IC can withstand high temperature environments without compromising functionality.

Technology: CMOS

The CMOS technology used in this interface IC offers low power consumption and high noise immunity, making it an energy-efficient and reliable choice.

Technical Specifications

Other Function Interface ICs PCA9605D,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5.5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.001 mA

Nominal Supply Voltage:

5.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PCA9605D,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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