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NXB0102GF,115

NXP Semiconductors

NXB0102GF,115 by NXP Semiconductors

NXB0102GF,115 by NXP Semiconductors is a compact automotive interface IC with an operating temp range of -40 °C to 125 °C. It features a dual terminal design in a small outline package and supports power supplies from 1.2V to 5V. Ideal for surface mount applications, it ensures reliable performance in demanding environments.

Median Price

$0.254

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$0.264

1k+ parts

$0.219

10k+ parts

$0.196

5,000

-

$0.264

$0.219

$0.196

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.244

5,000

-

-

-

$0.244

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,800 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

-

3,800

$0.206

-

-

-

DigiKey Marketplace

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.230

10k+ parts

-

5,000

-

-

$0.230

-

Vyrian

USA . 4,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,970

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-

-

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Anansix

USA . 2,321 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,321

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,664 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

10k+ parts

-

4,664

$0.184

-

-

-

Corphita

USA . 2,287 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

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2,287

$0.195

-

-

-

Vigor

Singapore . 194 parts In-Stock

1+ parts

$0.210

100+ parts

-

1k+ parts

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10k+ parts

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194

$0.210

-

-

-

Component Stockers USA

USA . 7,371 parts In-Stock

1+ parts

$0.220

100+ parts

$0.210

1k+ parts

$0.190

10k+ parts

-

7,371

$0.220

$0.210

$0.190

-

Microchip USA

USA . 9,964 parts In-Stock

1+ parts

$1.365

100+ parts

-

1k+ parts

-

10k+ parts

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9,964

$1.365

-

-

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AZTECH Wire

Italy . 252 parts In-Stock

1+ parts

$8.550

100+ parts

-

1k+ parts

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10k+ parts

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252

$8.550

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 29,686 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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29,686

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UNI Independent Distributors

Spain . 1,508 parts In-Stock

1+ parts

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100+ parts

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1,508

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Overview

Elevate your projects with the NXB0102GF,115 from NXP Semiconductors, a trusted leader in innovative solutions. Designed for versatility and reliability, this interface IC boasts robust performance across automotive applications, ensuring seamless connectivity in demanding environments. Its compact, heat-resistant design guarantees optimal functionality from -40 °C to 125 °C, providing engineers with peace of mind and enhanced efficiency for their designs. Experience quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC

The plastic material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact and efficient circuit designs, making it ideal for applications with space constraints.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB and facilitates better layout possibilities for integrated circuits.

Power Supplies (V): 1.2/3.6, 1.8/5

Wide input voltage options enhance versatility and compatibility with different system designs and voltage requirements.

No. of Terminals: 8

The eight terminals provide sufficient connectivity for various functions while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in achieving high density in board layouts, perfect for modern electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes this product suitable for demanding environments, ensuring reliability in automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the IC to function in extreme conditions, further cementing its reliability for automotive and industrial use.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing on printed circuit boards, improving design flexibility.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets stringent quality and reliability standards required for vehicle electronics.

Terminal Form: NO LEAD

No-lead design simplifies assembly and enhances thermal performance, making it a strong choice for modern electronic systems.

Terminal Pitch: 0.35 mm

A 0.35 mm terminal pitch allows for tighter packing of components, resulting in smaller and more efficient designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC excels in providing connectivity and communication between various components, crucial for system integration.

Technical Specifications

Other Function Interface ICs NXB0102GF,115 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC

Package Code:

SON

Package Equivalence Code:

SOLCC8,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Trade Compliance

NXB0102GF,115 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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