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NXB0102GT,115

NXP Semiconductors

NXB0102GT,115 by NXP Semiconductors

NXB0102GT,115 by NXP Semiconductors is a compact automotive interface IC designed for surface mounting. It operates within a voltage range of 1.2-5V and withstands temperatures from -40 °C to 125 °C. Ideal for automotive applications, it features an 8-terminal no-lead design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,712 parts In-Stock

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3,712

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Digiode

USA . 2,314 parts In-Stock

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2,314

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Anansix

USA . 543 parts In-Stock

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543

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Distributors (Availability)

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Vigor

Singapore . 725 parts In-Stock

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$0.210

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725

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Microchip USA

USA . 1,624 parts In-Stock

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$0.402

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1,624

$0.402

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One Stop Electronics

USA . 483 parts In-Stock

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$18.500

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483

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Corphita

USA . 4,036 parts In-Stock

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4,036

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UNI Independent Distributors

Spain . 3,040 parts In-Stock

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3,040

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Overview

Elevate your designs with the NXB0102GT,115 from NXP Semiconductors—an industry leader renowned for innovation and quality. This versatile interface IC is engineered to excel in automotive applications, offering durability in extreme temperatures while ensuring seamless connectivity. With its compact surface-mount design, it maximizes space without compromising performance. Experience reliability and efficiency that translate into enhanced product value for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC

The use of plastic for the package body provides durability and weight efficiency, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology enhances performance by allowing for tighter packing on PCBs, resulting in reduced size and improved reliability.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space usage on the PCB, making it easier to integrate into different layouts.

Power Supplies (V): 1.2/3.6, 1.8/5

Wide input voltage range enhances compatibility with various systems and provides flexibility in design, accommodating different power supply configurations.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for diverse applications while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures efficient use of space and is ideal for applications where board real estate is at a premium.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows the product to operate reliably in demanding environments, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold conditions, making it ideal for outdoor and harsh environment applications.

Terminal Position: DUAL

Dual terminal positioning offers versatility for layout and design, facilitating easier connections on varied PCB designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates high reliability and durability, ensuring safe and consistent performance in automotive applications.

Terminal Form: NO LEAD

No-lead design enhances space-saving capabilities and facilitates easier PCB assembly, while also improving thermal performance.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for more compact designs and greater flexibility in circuit layout, perfect for high-density applications.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this product enables communication between different systems or devices, making it essential for various electronic applications.

Technical Specifications

Other Function Interface ICs NXB0102GT,115 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC

Package Code:

SON

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NXB0102GT,115 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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