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NXB0102DP,125

NXP Semiconductors

NXB0102DP,125 by NXP Semiconductors

NXB0102DP,125 from NXP Semiconductors is a versatile interface IC designed for automotive applications. It operates within a temperature range of -40 °C to 125 °C and supports power supplies of 1.2/3.6V and 1.8/5V. This compact, surface-mount device features an 8-terminal gull-wing design for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,834 parts In-Stock

1+ parts

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2,834

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Digiode

USA . 1,703 parts In-Stock

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1,703

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Anansix

USA . 189 parts In-Stock

1+ parts

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189

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,161 parts In-Stock

1+ parts

$24.500

100+ parts

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1,161

$24.500

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UNI Independent Distributors

Spain . 4,471 parts In-Stock

1+ parts

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4,471

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Corphita

USA . 661 parts In-Stock

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661

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Overview

Elevate your designs with the NXB0102DP,125 from NXP Semiconductors, a leader in cutting-edge technology. This compact interface IC combines durability and efficiency, making it perfect for automotive applications where performance matters most. With its robust temperature range and reliable surface mount design, you can trust in seamless integration and long-lasting operation. Experience unparalleled quality and innovation that empowers your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC

The plastic body material is lightweight and offers good protection against environmental factors, making it suitable for diverse applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly, which is ideal for modern electronics requiring space-saving solutions.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into various circuit designs, enhancing compatibility and versatility in applications.

Power Supplies (V): 1.2/3.6, 1.8/5

With a wide range of input voltage options, this IC can operate in multiple environments, making it flexible for various applications.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity for different functionalities while maintaining a compact footprint, which is essential in tight spaces.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline with a thin profile minimizes space consumption on PCBs, making it ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125 °C ensures that this product can function reliably in high-temperature environments, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can withstand extreme cold, making it perfect for outdoor applications.

Terminal Position: DUAL

Dual terminal positioning enhances circuit accessibility and improves layout flexibility during PCB design.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade signifies robustness and reliability, essential for components used in vehicles.

Terminal Form: GULL WING

The gull-wing terminal form allows for easier soldering and better electrical performance, ensuring secure connections.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for compact designs while ensuring sufficient spacing for reliable soldering and performance.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type, this IC is designed to facilitate communication between different components, making it essential for complex electronic systems.

Technical Specifications

Other Function Interface ICs NXB0102DP,125 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC

Package Code:

Package Equivalence Code:

TSSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

NXB0102DP,125 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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