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NXB0102GD,125

NXP Semiconductors

NXB0102GD,125 by NXP Semiconductors

NXB0102GD,125 from NXP Semiconductors is a compact interface IC designed for automotive applications. It operates within a voltage range of 1.2-5V and withstands temperatures from -40 °C to 125 °C. Its dual no-lead terminals ensure efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,405 parts In-Stock

1+ parts

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2,405

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Anansix

USA . 1,439 parts In-Stock

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1,439

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Digiode

USA . 176 parts In-Stock

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176

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 479 parts In-Stock

1+ parts

$22.500

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479

$22.500

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Corphita

USA . 4,273 parts In-Stock

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4,273

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UNI Independent Distributors

Spain . 1,203 parts In-Stock

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1,203

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Overview

Unlock the power of innovation with the NXB0102GD,125 from NXP Semiconductors! This compact interface IC is designed for automotive applications, ensuring robust performance in extreme conditions. With superior quality and precision engineering from a trusted leader in semiconductor solutions, you can enhance your projects with reliability and efficiency. Elevate your designs while enjoying exceptional value and support—experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC

The use of plastic in the package body offers a lightweight design while providing adequate protection for the IC, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for efficient use of PCB space and aids in automated assembly processes, enhancing manufacturing throughput.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier integration into various circuit layouts, providing flexibility in design.

Power Supplies (V): 1.2/3.6, 1.8/5

The dual voltage supply capability makes this IC versatile and compatible with a wide range of systems and applications.

No. of Terminals: 8

Having 8 terminals supports multiple connections, facilitating robust interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact footprint, allowing for high-density designs without compromising performance.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this IC suitable for demanding environments, ensuring reliable performance in automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures functionality in extreme conditions, essential for automotive and other harsh environment applications.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in development, allowing for varied board layouts and enhancing design versatility.

Temperature Grade: AUTOMOTIVE

Being classified as automotive grade indicates that this IC meets stringent reliability standards necessary for automotive applications.

Terminal Form: NO LEAD

The no lead design minimizes the package size and improves thermal and electrical performance, particularly useful for compact designs.

Terminal Pitch: 0.5 mm

The smaller terminal pitch allows for closer placement of connections, supporting modern compact circuit designs.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type makes this product essential for communication between different electronic systems, enhancing interoperability in designs.

Technical Specifications

Other Function Interface ICs NXB0102GD,125 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NXB0102GD,125 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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