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PCA8536BT/Q900/1,1

NXP Semiconductors

PCA8536BT/Q900/1,1 by NXP Semiconductors

The PCA8536BT/Q900/1 by NXP Semiconductors is a CMOS interface IC designed for segment displays, supporting up to 40 characters and 320 segments. It operates b/w -40 °C to 95 °C with a supply voltage of 2-5V. Ideal for industrial applications, it features a compact SO thin profile package.

Median Price

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Lifecycle Status

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4

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1k+

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Flip Electronics

USA . 6,000 parts In-Stock

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Digiode

USA . 4,198 parts In-Stock

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Vyrian

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Anansix

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Vigor

Singapore . 1,074 parts In-Stock

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$2.750

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Modulus Dynamics

Lithuania . 100 parts In-Stock

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$5.871

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$5.871

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AZTECH Wire

Italy . 291 parts In-Stock

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$12.260

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One Stop Electronics

USA . 762 parts In-Stock

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UNI Independent Distributors

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Corphita

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Perfect Parts

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Microchip USA

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Overview

Unlock unparalleled performance with the PCA8536BT/Q900/1,1 from NXP Semiconductors! This cutting-edge interface IC delivers exceptional quality and reliability, making it perfect for diverse applications in automotive, industrial, and consumer electronics. Experience efficient power management and robust temperature resilience, ensuring seamless operation even under demanding conditions. Elevate your designs with NXP's proven expertise—where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using durable and lightweight plastic/epoxy material enhances reliability and longevity, making it suitable for diverse applications.

Display Mode: SEGMENT

Segment display mode allows for clear and efficient visualization of data which is critical in various electronic applications.

Surface Mount: YES

Surface mount capability facilitates easier integration into compact circuit designs, saving valuable board space.

Screening Level: AEC-Q100

AEC-Q100 screening indicates high reliability and automotive-grade performance, ensuring suitability for critical applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on circuit boards, enabling higher-density designs.

Power Supplies (V): 2/5

Dual power supply voltage options provide versatility for integration into various systems, accommodating different design requirements.

No. of Terminals: 56

A higher number of terminals enhances connectivity options, allowing for complex functionality in a compact package.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile reduce space requirements, ideal for modern compact electronic designs.

No. of Backplanes: 8-BP

Support for 8 backplanes enhances the device's connectivity and scalability in larger systems, providing robust performance.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, this product is suitable for demanding environments and applications.

Minimum Operating Temperature: -40 °C

A wide operating temperature range ensures reliability in extreme conditions, making it suitable for various industrial applications.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options, aiding in design adaptability and ease of installation.

Peak Reflow Temperature °C: 260

A high peak reflow temperature enables compatibility with modern soldering processes, ensuring a strong bond during assembly.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies durability and reliability, ensuring the product meets stringent industry standards.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminal configuration facilitates easy soldering and assembly, improving manufacturing efficiency.

Maximum Supply Current: 0.13 mA

Low maximum supply current improves energy efficiency, making it suitable for battery-powered or low-power applications.

No. of Digits/Characters: 40-CHARACTER

The capability to display 40 characters allows for extensive information display, enhancing communication in applications.

No. of Segments: 320

With 320 segments available, this product can support complex displays, making it versatile for various user interfaces.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch optimizes space usage while ensuring reliable electrical connections, critical in compact designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type, this IC facilitates smooth communication with other components, enhancing overall system performance.

Technical Specifications

Other Function Interface ICs PCA8536BT/Q900/1,1 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G56

Moisture Sensitivity Level (MSL):

1

No. of Backplanes:

8-BP

No. of Digits/Characters:

40-CHARACTER

No. of Segments:

320

No. of Terminals:

56

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.13 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

PCA8536BT/Q900/1,1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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