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PCA8536BT/Q900/1Y

NXP Semiconductors

PCA8536BT/Q900/1Y by NXP Semiconductors

INTERFACE CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,007 parts In-Stock

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1,007

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Digiode

USA . 874 parts In-Stock

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874

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Anansix

USA . 414 parts In-Stock

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414

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Nova Conductors

Japan . 97 parts In-Stock

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97

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Distributors (Availability)

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Microchip USA

USA . 4,119 parts In-Stock

1+ parts

$10.992

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4,119

$10.992

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Semicontronic

India . 364 parts In-Stock

1+ parts

$12.500

100+ parts

$12.188

1k+ parts

$12.125

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364

$12.500

$12.188

$12.125

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AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$18.620

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390

$18.620

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Ampacity Inc.

Singapore . 1,454 parts In-Stock

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$34.500

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1,454

$34.500

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One Stop Electronics

USA . 783 parts In-Stock

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$46.500

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783

$46.500

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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UNI Independent Distributors

Spain . 7,916 parts In-Stock

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7,916

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Continental Prestige Electronics

USA . 4,781 parts In-Stock

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4,781

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Corphita

USA . 3,261 parts In-Stock

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3,261

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Argo Parts USA

USA . 2,758 parts In-Stock

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2,758

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Technical Specifications

Other Function Interface ICs PCA8536BT/Q900/1Y attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Trade Compliance

PCA8536BT/Q900/1Y Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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