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PCA8536AT/Q900/1,1

NXP Semiconductors

PCA8536AT/Q900/1,1 by NXP Semiconductors

The PCA8536AT/Q900/1 by NXP Semiconductors is a CMOS interface IC designed for segment displays, supporting up to 40 characters with 320 segments. It operates b/w -40 °C and 95 °C, making it suitable for industrial applications. This surface-mount device features a compact design with 56 terminals and AEC-Q100 screening.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,196 parts In-Stock

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Digiode

USA . 3,189 parts In-Stock

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Anansix

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AZTECH Wire

Italy . 789 parts In-Stock

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$20.280

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One Stop Electronics

USA . 397 parts In-Stock

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$49.500

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QUARKTWIN TECHNOLOGY LTD

USA . 24,398 parts In-Stock

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Microchip USA

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Corphita

USA . 3,760 parts In-Stock

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UNI Independent Distributors

Spain . 2,642 parts In-Stock

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Overview

Unlock the potential of your designs with the PCA8536AT/Q900/1 from NXP Semiconductors, a leader in quality and innovation. This versatile interface IC is engineered for reliability in demanding environments, making it ideal for automotive displays, industrial controls, and more. Enjoy enhanced performance and efficiency with its compact design, ensuring seamless integration into your projects while delivering exceptional value and long-lasting benefits. Elevate your applications with NXP's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package material provides excellent durability and protection against environmental factors, making this product suitable for diverse applications.

Display Mode: SEGMENT

Segment display mode ensures clear visibility and ease of reading, enhancing the user interface in various devices.

Surface Mount: YES

Being a surface mount device facilitates integration into compact designs, saving valuable PCB space.

Screening Level: AEC-Q100

Complying with the AEC-Q100 standard ensures the product is designed for automotive applications, assuring high reliability in critical conditions.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout on PCBs, allowing for efficient use of space and easier routing.

Power Supplies: 2/5 V

Operating with a wide voltage range of 2 to 5 volts enables compatibility with various electronic systems and enhances flexibility in design.

No. of Terminals: 56

With 56 terminals, this IC provides ample connections for complex functionalities, making it suitable for advanced applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design contribute to a compact solution, ideal for space-constrained electronic devices.

No. of Backplanes: 8-BP

8 backplanes enhance the interface capabilities, allowing for more complex communication and control tasks in applications.

Maximum Operating Temperature: 95 °C

A maximum operating temperature of 95 °C emphasizes thermal reliability, ensuring the IC can perform effectively under high-temperature conditions.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this IC suitable for harsh environments, expanding its applicability across various industries.

Terminal Position: DUAL

Dual terminal positioning provides flexible mount options, accommodating different PCB designs and user preferences.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature indicates compatibility with modern soldering processes, ensuring dependability during manufacturing.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grade assures robustness and performance stability in demanding situations.

Technology: CMOS

CMOS technology guarantees low power consumption and high speed, enhancing the energy efficiency and performance of the device.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and solder joint inspection, making assembly and maintenance more user-friendly.

Maximum Supply Current: 0.13 mA

A low maximum supply current of 0.13 mA contributes to overall system power efficiency, making it ideal for battery-operated devices.

No. of Digits/Characters: 40-CHARACTER

The capability to display up to 40 characters enables versatile applications, catering to user needs in various display requirements.

No. of Segments: 320

With 320 segments, this IC can create detailed and dynamic displays, enhancing the visual experience for users.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm offers a compact layout, which is vital for high-density PCB designs in advanced electronic products.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type, the IC facilitates seamless communication between different modules, enhancing system integration and functionality.

Technical Specifications

Other Function Interface ICs PCA8536AT/Q900/1,1 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G56

Moisture Sensitivity Level (MSL):

1

No. of Backplanes:

8-BP

No. of Digits/Characters:

40-CHARACTER

No. of Segments:

320

No. of Terminals:

56

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.13 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

PCA8536AT/Q900/1,1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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