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PCA9605DP,118

NXP Semiconductors

PCA9605DP,118 by NXP Semiconductors

PCA9605DP,118 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage of 5.5V and low supply current of 0.001mA. It operates in industrial temperature range (-40 to 85°C) and is suitable for various applications requiring an interface circuit in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 3,822 parts In-Stock

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Digiode

USA . 2,902 parts In-Stock

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Anansix

USA . 2,824 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 440 parts In-Stock

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$5.313

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Microchip USA

USA . 358 parts In-Stock

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$6.201

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One Stop Electronics

USA . 1,603 parts In-Stock

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$20.500

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Ampacity Inc.

Singapore . 1,087 parts In-Stock

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$45.500

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Corphita

USA . 3,919 parts In-Stock

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UNI Independent Distributors

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Aranea Global

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Overview

Upgrade your electronic systems with the NXP Semiconductors PCA9605DP,118. This cutting-edge interface IC offers unparalleled quality and reliability from a trusted manufacturer. Ideal for a wide range of applications, this product provides customers with enhanced connectivity and performance. Say goodbye to technical headaches and hello to seamless integration with the PCA9605DP,118. Experience the value and benefits it brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and resistance to external elements, making the product long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, saving time and effort.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for use in a wide range of environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance of the product.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this product facilitates communication between different components, making it an essential part of electronic systems.

Technical Specifications

Other Function Interface ICs PCA9605DP,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5.5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.001 mA

Nominal Supply Voltage:

5.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PCA9605DP,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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