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NXS0102GF,115

NXP Semiconductors

NXS0102GF,115 by NXP Semiconductors

NXS0102GF,115 by NXP Semiconductors is a dual terminal interface IC designed for automotive applications. It operates within a temperature range of -40 °C to 125 °C and supports power supplies of 1.8/3.3V, 2.5/5V in a compact SO package. Its no-lead design ensures efficient surface mounting for space-constrained environments.

Median Price

$0.254

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

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$0.264

1k+ parts

$0.219

10k+ parts

$0.196

5,000

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$0.264

$0.219

$0.196

Verical

USA . 5,000 parts In-Stock

1+ parts

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$0.244

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$0.244

Distributors (In-Stock)

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Digiode

USA . 1,339 parts In-Stock

1+ parts

$0.206

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1,339

$0.206

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DigiKey Marketplace

USA . 5,000 parts In-Stock

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Vyrian

USA . 3,360 parts In-Stock

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Anansix

USA . 948 parts In-Stock

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948

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Distributors (Availability)

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Corphita

USA . 2,131 parts In-Stock

1+ parts

$0.195

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$0.195

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Vigor

Singapore . 261 parts In-Stock

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$0.210

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261

$0.210

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Microchip USA

USA . 6,014 parts In-Stock

1+ parts

$1.365

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6,014

$1.365

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AZTECH Wire

Italy . 713 parts In-Stock

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$19.010

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713

$19.010

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QUARKTWIN TECHNOLOGY LTD

USA . 12,500 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,109 parts In-Stock

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Overview

Unlock seamless connectivity with the NXS0102GF,115 from NXP Semiconductors, a leader in innovation and reliability. This cutting-edge interface IC is designed for automotive applications, providing exceptional performance in extreme conditions—from -40 °C to 125 °C. Its compact, surface-mount design enhances space efficiency while ensuring robust functionality. Trust in NXP's commitment to quality and elevate your projects with a solution that combines versatility and durability for unmatched results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures good mechanical strength and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for compact circuit designs and facilitates automated assembly processes, improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard footprint that is compatible with a wide range of board layouts, making it versatile for various applications.

Power Supplies (V): 1.8/3.3, 2.5/5

Dual voltage support ensures flexibility in design, allowing it to be used in systems with different power supply requirements.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for a variety of signals, ensuring compatibility with multiple interfacing scenarios.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space savings on printed circuit boards, ideal for compact electronic designs.

Maximum Operating Temperature: 125 °C

The capability to operate at high temperatures ensures reliability in demanding environments, particularly in automotive applications.

Minimum Operating Temperature: -40 °C

The low temperature operating range adds to the reliability in extreme conditions, making it suitable for environments subject to temperature fluctuations.

Terminal Position: DUAL

Dual terminal positions allow for greater flexibility in layout and soldering, enhancing ease of use in PCB design.

Temperature Grade: AUTOMOTIVE

Designed to meet the automotive temperature grade, ensuring suitability for automotive applications that require strict reliability standards.

Terminal Form: NO LEAD

No-lead terminals promote a smaller footprint and lower profile, facilitating high-density board designs while supporting advanced soldering techniques.

Terminal Pitch: 0.35 mm

A 0.35 mm terminal pitch supports modern high-density designs, allowing for compact placements of components on PCBs.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, it is optimized for seamless communication between different components, enhancing overall system performance.

Technical Specifications

Other Function Interface ICs NXS0102GF,115 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.8/3.3,2.5/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Trade Compliance

NXS0102GF,115 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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