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NXS0102GD,125

NXP Semiconductors

NXS0102GD,125 by NXP Semiconductors

NXS0102GD,125 from NXP Semiconductors is a dual terminal interface IC designed for automotive applications. It operates within a temperature range of -40 °C to 125 °C and supports power supplies of 1.8/3.3V, 2.5/5V in a compact SO package. Its no-lead design ensures efficient surface mounting for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,351 parts In-Stock

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4,351

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Vyrian

USA . 3,930 parts In-Stock

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3,930

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Anansix

USA . 258 parts In-Stock

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258

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One Stop Electronics

USA . 868 parts In-Stock

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$9.500

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868

$9.500

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UNI Independent Distributors

Spain . 5,722 parts In-Stock

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5,722

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Corphita

USA . 2,096 parts In-Stock

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Overview

Unlock the potential of your automotive designs with the NXS0102GD,125 from NXP Semiconductors. Renowned for their exceptional quality and reliability, NXP empowers innovators with versatile interface solutions that thrive in extreme temperatures. This compact, surface-mount IC enhances connectivity while ensuring durability, making it ideal for modern vehicle applications. Elevate your projects with a trusted partner dedicated to performance and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a lightweight and durable construction, making the IC suitable for various applications, especially in automotive environments.

Surface Mount: YES

Surface mount capability allows for efficient use of space on the PCB, enabling high-density designs and improving manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for maintaining consistency in layout and facilitating easy integration into existing circuit designs.

Power Supplies (V): 1.8/3.3, 2.5/5

Dual voltage supply options enhance flexibility, allowing the IC to operate in various designs and systems requiring different voltage levels.

No. of Terminals: 8

An 8-terminal configuration strikes a balance between functionality and compactness, making it suitable for both simple and moderately complex applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space-saving advantages, enabling more efficient designs, especially in compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this IC is capable of withstanding harsh conditions, making it ideal for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures (-40 °C) ensures reliability in extreme environments, making this product suitable for outdoor and automotive uses.

Terminal Position: DUAL

Dual terminal positioning allows for better layout flexibility, which can lead to improved signal integrity in PCBs.

Temperature Grade: AUTOMOTIVE

Designed with automotive grade specifications, this IC assures reliability and performance in vehicle applications, adhering to strict industry standards.

Terminal Form: NO LEAD

No lead terminal form reduces the overall footprint of the IC, enabling denser circuit designs while improving solder joint reliability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates compact designs and higher packing density, ideal for advanced electronic applications.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it effectively facilitates communication between different system components, contributing to efficient data transfer and overall system performance.

Technical Specifications

Other Function Interface ICs NXS0102GD,125 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.8/3.3,2.5/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NXS0102GD,125 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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