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NVT2002GF,115

NXP Semiconductors

NVT2002GF,115 by NXP Semiconductors

NVT2002GF,115 by NXP Semiconductors is a compact interface IC designed for industrial applications. It operates within a supply voltage range of 0 to 5.5 V and withstands temperatures from -40 °C to 85 °C. Its small outline and dual terminal design make it ideal for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,181 parts In-Stock

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Digiode

USA . 4,608 parts In-Stock

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4,608

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Anansix

USA . 591 parts In-Stock

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591

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Microchip USA

USA . 296 parts In-Stock

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$0.722

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296

$0.722

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AZTECH Wire

Italy . 1,129 parts In-Stock

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$21.000

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One Stop Electronics

USA . 1,338 parts In-Stock

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$43.500

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UNI Independent Distributors

Spain . 6,900 parts In-Stock

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Corphita

USA . 1,701 parts In-Stock

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Overview

Unlock the potential of your designs with the NVT2002GF,115 from NXP Semiconductors. Engineered for excellence, this ultra-thin interface IC delivers reliability across a wide temperature range, making it ideal for industrial applications. NXP’s commitment to quality ensures you benefit from superior performance and longevity, while its compact size offers design flexibility. Elevate your projects with a trusted component that blends innovation, efficiency, and unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this product lightweight and suitable for various consumer and industrial applications.

Surface Mount: YES

Surface mount technology allows for a reduced footprint and easier integration into modern PCBs, making assembly more efficient.

Maximum Supply Voltage: 5.4 V

This moderate maximum supply voltage ensures compatibility with a wide range of battery and power supply systems.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating better design layouts and component positioning.

Maximum Supply Voltage-1: 5.5 V

Offering flexibility in supply voltage allows for versatility in different application environments.

Power Supplies (V): 1/3.6, 1.8/5.5

The range of power supply options provides adaptability in various electronic circuits and devices.

No. of Terminals: 8

Having 8 terminals ensures sufficient connectivity for signal and power needs while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The thin profile makes this IC ideal for space-constrained applications, allowing for compact device designs.

Minimum Supply Voltage-1: 0 V

Starting from a minimum supply voltage of 0 V enhances the flexibility and reliability in low-power applications.

Minimum Supply Voltage: 0 V

This characteristic allows the IC to safely operate in a range of conditions, including low and powered-off states.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for industrial applications that require durability under extreme conditions.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures expands its applicability for outdoor and harsh environment electronics.

Terminal Position: DUAL

Dual terminal positioning allows for effective signal distribution and ground connections in compact circuit designs.

Maximum Seated Height: 0.5 mm

A low seated height contributes to the thin profile, making it ideal for modern slim devices.

Width: 1 mm

The narrow width facilitates integration into dense circuit designs without compromising performance.

Length: 1.35 mm

Short length enhances space efficiency on PCBs, promoting more compact and efficient design layouts.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness and reliability for a wide range of operating environments.

Terminal Form: NO LEAD

No lead terminals improve reliability by reducing parasitic inductance and capacitance in the circuit.

Terminal Pitch: 0.35 mm

A small terminal pitch allows for greater design flexibility while maintaining a compact size.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing applications, this IC is ideal for improving communication between various components.

Technical Specifications

Other Function Interface ICs NVT2002GF,115 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also Required Vref(B) Supply 0 to 5.5V

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

Length:

1.35 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

1/3.6,1.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

5.4 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NVT2002GF,115 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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