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NVT2002TL,118

NXP Semiconductors

NVT2002TL,118 by NXP Semiconductors

NVT2002TL,118 from NXP Semiconductors is a dual terminal interface IC designed for industrial applications. It operates within a supply voltage range of 0V to 5.5V and withstands temperatures from -40 °C to 85 °C. Its compact size (1.7mm x 1.35mm) makes it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,820 parts In-Stock

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3,820

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Anansix

USA . 934 parts In-Stock

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934

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Digiode

USA . 768 parts In-Stock

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768

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Distributors (Availability)

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One Stop Electronics

USA . 1,345 parts In-Stock

1+ parts

$16.500

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1,345

$16.500

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UNI Independent Distributors

Spain . 6,568 parts In-Stock

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6,568

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Corphita

USA . 4,831 parts In-Stock

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4,831

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Overview

Discover the NVT2002TL,118 from NXP Semiconductors—your go-to solution for reliable, high-performance interfacing. Renowned for quality and innovation, NXP delivers exceptional value through this compact, robust IC designed for diverse applications, including industrial automation and consumer electronics. With its low power consumption and wide temperature range, it ensures optimal performance in any environment, empowering your projects with unmatched efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental stressors, making this product reliable for long-term applications.

Surface Mount: YES

Being surface mount allows for more compact PCB designs and improved space efficiency in electronic devices.

Maximum Supply Voltage: 5.4 V

A maximum supply voltage of 5.4 V makes this IC compatible with a wide range of devices and power supply systems.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into existing designs and optimizes layout on PCBs.

Maximum Supply Voltage-1: 5.5 V

This versatile voltage rating provides greater flexibility for design engineers in selecting power supply options.

Power Supplies (V): 1/3.6, 1.8/5.5

The ability to operate at different voltage levels enhances flexibility and compatibility across various applications.

No. of Terminals: 8

With eight terminals, this IC can handle multiple connections, enabling complex functionalities in compact designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This packaging style allows for efficient thermal management while maintaining a low profile, ideal for space-constrained applications.

Minimum Supply Voltage: 0 V

Supporting a minimum supply voltage of 0 V increases design flexibility, particularly in low-power applications.

Maximum Operating Temperature: 85 °C

This high operating temperature rating ensures reliable performance in environments where heat is an issue, suitable for industrial use.

Minimum Operating Temperature: -40 °C

A wide operational temperature range (-40 °C to 85 °C) allows this IC to function in extreme conditions, enhancing its usability in industrial applications.

Terminal Position: DUAL

Dual terminal positioning supports diverse circuitry and layout arrangements, making the IC more versatile for various designs.

Maximum Seated Height: 0.5 mm

The low seated height of 0.5 mm allows for ultra-thin designs, making it perfect for space-restricted applications.

Width: 1.35 mm

A width of 1.35 mm supports compact designs, allowing engineers to save space without sacrificing functionality.

Length: 1.7 mm

The compact length makes this IC suitable for high-density circuit layouts, enhancing overall device efficiency.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this IC is built for durability and reliability in demanding environments.

Terminal Form: NO LEAD

No lead terminals enhance design flexibility and reduce the footprint, allowing for more compact circuits.

Terminal Pitch: 0.4 mm

The 0.4 mm terminal pitch maximizes connection density, supporting high-performance applications.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC is essential for communication between different components, adding significant value in system integration.

Technical Specifications

Other Function Interface ICs NVT2002TL,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also Required Vref(B) Supply 0 to 5.5V

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

Length:

1.7 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.05,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1/3.6,1.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

5.4 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1.35 mm

Trade Compliance

NVT2002TL,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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