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NVT2002TL

NXP Semiconductors

NVT2002TL by NXP Semiconductors

NVT2002TL by NXP Semiconductors is a versatile interface IC with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 85 °C. Its compact design features an 8-terminal, no-lead package for efficient surface mounting. Ideal for industrial applications requiring reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,497 parts In-Stock

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Anansix

USA . 1,572 parts In-Stock

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Vyrian

USA . 813 parts In-Stock

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One Stop Electronics

USA . 1,201 parts In-Stock

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$7.500

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UNI Independent Distributors

Spain . 4,243 parts In-Stock

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Corphita

USA . 969 parts In-Stock

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Overview

Unlock the potential of your designs with the NVT2002TL from NXP Semiconductors—a leader in innovative technology. This sleek, surface-mount interface IC excels in both industrial and consumer applications, delivering exceptional quality and reliability. Its compact design ensures seamless integration while operating efficiently across a wide temperature range. Choose NXP for unparalleled performance and elevate your projects with the NVT2002TL's versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection and stability, ensuring reliability in various environments.

Surface Mount: YES

The surface mount capability allows for compact designs and automated assembly, making it suitable for modern electronics.

Maximum Supply Voltage: 3.6 V

This voltage specification is adequate for low-power applications, providing flexibility in design while ensuring efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, facilitating easier layout and component placement.

Maximum Supply Voltage-1: 5.5 V

The higher supply voltage limit allows integration in a wider range of applications, catering to both low and moderate power needs.

No. of Terminals: 8

With 8 terminals, this IC offers multiple connection options, enhancing its versatility in various applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink/slug design contribute to efficient heat dissipation while saving space on the circuit board.

Minimum Supply Voltage-1: 1.8 V

This low minimum voltage makes the IC ideal for energy-efficient applications, extending battery life in portable devices.

Minimum Supply Voltage: 1 V

The ability to operate at such a low voltage enhances the compatibility of this IC with various low-power systems.

Maximum Operating Temperature: 85 °C

The high temperature rating ensures reliability and stability in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

This IC can function in extreme cold conditions, making it ideal for applications in harsh climates.

Terminal Position: DUAL

Dual terminal positions allow for flexible mounting options and can help improve the design layout in compact spaces.

Maximum Seated Height: 0.5 mm

The low seated height facilitates a flat surface mount, which is crucial for high-density circuit designs.

Width: 1.35 mm

This narrow width helps in space-constrained applications, allowing for more components to be packed into a smaller area.

Length: 1.7 mm

With a compact length, it provides flexibility in design arrangements and contributes to overall product miniaturization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies robustness and reliability in critical applications, suitable for long-term use.

Terminal Form: NO LEAD

No lead design reduces the overall footprint and enhances the capabilities for automated assembly processes.

Terminal Pitch: 0.4 mm

A pitch of 0.4 mm allows for high-density designs and is compatible with modern PCB layouts requiring compact components.

Interface IC Type: INTERFACE CIRCUIT

This designation means the IC is designed specifically for communication between different circuits, enhancing overall system performance.

Technical Specifications

Other Function Interface ICs NVT2002TL attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also Required Vref(B) Supply 0 to 5.5V

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

Length:

1.7 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.05,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1.35 mm

Trade Compliance

NVT2002TL Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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