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NVT2002GM,125

NXP Semiconductors

NVT2002GM,125 by NXP Semiconductors

NVT2002GM,125 from NXP Semiconductors is a versatile interface IC with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 85 °C. It features an 8-terminal design in a compact square package. Ideal for industrial applications requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,510 parts In-Stock

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2,510

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Vyrian

USA . 1,419 parts In-Stock

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1,419

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Anansix

USA . 858 parts In-Stock

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858

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One Stop Electronics

USA . 600 parts In-Stock

1+ parts

$46.500

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600

$46.500

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UNI Independent Distributors

Spain . 7,790 parts In-Stock

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7,790

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Corphita

USA . 1,656 parts In-Stock

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Overview

Unlock unparalleled performance with the NVT2002GM,125 from NXP Semiconductors. This compact interface IC seamlessly enhances your designs, ensuring reliability and durability in demanding environments. With a robust temperature range and industry-leading manufacturing quality, it’s perfect for a myriad of applications, from industrial automation to consumer electronics. Elevate your projects with a trusted solution that delivers exceptional value and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology enables compact designs and efficient space utilization on PCBs, ideal for modern electronics.

Maximum Supply Voltage: 5.4 V

With a maximum supply voltage of 5.4 V, the product is versatile enough to work within a standard range for many electronic devices.

Package Shape: SQUARE

The square package shape aids in space-efficient layouts, allowing for easier integration into compact circuitry.

Maximum Supply Voltage-1: 5.5 V

This slight increase in maximum supply voltage provides added flexibility in power management for designers.

Power Supplies (V): 1/3.6, 1.8/5.5

Supports multiple power supply options, providing flexibility and adaptability for various applications.

No. of Terminals: 8

The 8-terminal configuration allows for a robust and reliable connection while maintaining a compact footprint.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This design ensures efficient heat dissipation while maintaining a low profile suitable for slim devices.

Minimum Supply Voltage-1: 0 V

A minimum supply voltage of 0 V ensures that the product can operate without restrictions, ideal for battery-powered devices.

Minimum Supply Voltage: 0 V

Allows for flexible use in low-power applications, making it suitable for energy-efficient products.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability even in demanding environments.

Minimum Operating Temperature: -40 °C

Withstand extreme cold temperatures, making this product suitable for outdoor and harsh conditions.

Terminal Position: QUAD

Quad terminal positioning offers stability and ease of assembly in PCB layouts.

Maximum Seated Height: 0.5 mm

A low seated height is beneficial for space-constrained applications, allowing for thinner designs.

Width: 1.6 mm

This narrow width contributes to space-efficient designs and is optimal for compact electronic applications.

Length: 1.6 mm

Maintaining a consistent length with the width supports uniformity in design, enhancing assembly efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies reliability and performance in challenging environments, suitable for industrial applications.

Terminal Form: NO LEAD

No lead design is environmentally friendly and helps to simplify manufacturing processes.

Terminal Pitch: 0.5 mm

A pitch of 0.5 mm allows for high-density interconnections, maximizing space on PCBs.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, it provides essential communication capabilities for various electronic systems.

Technical Specifications

Other Function Interface ICs NVT2002GM,125 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also Required Vref(B) Supply 0 to 5.5V

Interface IC Type:

JESD-30 Code:

S-PQCC-N8

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1/3.6,1.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

5.4 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

1.6 mm

Trade Compliance

NVT2002GM,125 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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