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NVT2002DP

NXP Semiconductors

NVT2002DP by NXP Semiconductors

NVT2002DP by NXP Semiconductors is a versatile interface IC with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 85 °C. Its compact 8-terminal design (3mm x 3mm) suits space-constrained applications. Ideal for industrial use, it features surface mount technology for easy integration.

Median Price

$0.690

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,221 parts In-Stock

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$0.690

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$0.690

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Chip Stock

USA . 65,632 parts In-Stock

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Digiode

USA . 3,728 parts In-Stock

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Anansix

USA . 2,414 parts In-Stock

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Component Sense

UK . 239 parts In-Stock

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239

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Sunrise Surplus Inc.

USA . 138 parts In-Stock

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North Shore Components

USA . 2 parts In-Stock

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One Stop Electronics

USA . 1,206 parts In-Stock

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$44.500

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Futuretech Components

Singapore . 15,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,131 parts In-Stock

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Corphita

USA . 3,466 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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GreenTree Electronics

Israel . 392 parts In-Stock

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Overview

Unlock unparalleled performance in your designs with the NVT2002DP from NXP Semiconductors. Renowned for their commitment to quality, NXP delivers this cutting-edge interface IC that seamlessly integrates into a variety of applications—from industrial automation to consumer electronics. With its robust temperature range and compact design, the NVT2002DP ensures reliability and efficiency, empowering you to create innovative solutions that elevate your projects while driving down costs. Experience the difference with NXP, where excellence meets your needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy helps in providing durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

The surface mount design allows for easier and more efficient assembly on printed circuit boards, saving space and enabling higher component density.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-voltage applications, enhancing its versatility.

Package Shape: SQUARE

The square package shape facilitates straightforward layout options on PCBs, which can simplify the design process.

Maximum Supply Voltage-1: 5.5 V

The extended maximum supply voltage capability of 5.5 V allows for compatibility with higher voltage systems.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connectivity options for various interfacing needs without occupying excessive space.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile minimize space on the PCB, making it ideal for compact applications.

Minimum Supply Voltage-1: 1.8 V

Operating from a minimum supply voltage of 1.8 V opens up the product for low-power applications, enhancing battery life.

Minimum Supply Voltage: 1 V

The ability to work down to 1 V makes this IC suitable for ultra-low voltage environments, broadening its potential application areas.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for commercial applications where temperature fluctuation may occur.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable performance in harsh environments, such as automotive or industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish improves solderability and ensures better electrical performance, which enhances reliability over time.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design, accommodating various layout requirements.

Maximum Seated Height: 1.1 mm

A low maximum seated height of 1.1 mm allows for slim designs, making it an ideal choice for space-constrained applications.

Width: 3 mm

A compact width of 3 mm contributes to the overall minimized footprint of the product, enhancing design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures optimal solder joint quality, which is crucial for long-term reliability.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260 °C ensures compatibility with lead-free soldering processes, aligning with modern manufacturing practices.

Length: 3 mm

The length of 3 mm contributes to the small package size, making it suitable for portable and miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Grade suitable for industrial applications ensures robust performance in demanding environmental conditions.

Terminal Form: GULL WING

The gull wing terminal form allows for better mechanical strength and solderability, ensuring a stable connection on PCBs.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this IC is easy to integrate into modern compact designs without compromising connectivity.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this IC is ideal for facilitating communication between various electronic components, adding to its versatility.

Technical Specifications

Other Function Interface ICs NVT2002DP attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also Required Vref(B) Supply 0 to 5.5V

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NVT2002DP Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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