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NVT2001GM

NXP Semiconductors

NVT2001GM by NXP Semiconductors

NVT2001GM by NXP Semiconductors is a compact interface IC designed for industrial applications. It operates b/w 1V and 5.5V, with a max temp of 85 °C, featuring a thin profile and no-lead terminals. Ideal for space-constrained environments requiring reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics

USA . 104,950 parts In-Stock

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Vyrian

USA . 4,185 parts In-Stock

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Digiode

USA . 2,793 parts In-Stock

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Anansix

USA . 159 parts In-Stock

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159

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One Stop Electronics

USA . 985 parts In-Stock

1+ parts

$28.500

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985

$28.500

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Kepictronics

USA . 70,988 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Corphita

USA . 3,037 parts In-Stock

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UNI Independent Distributors

Spain . 2,644 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,949 parts In-Stock

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Metaverse IC Inc.

Canada . 1,750 parts In-Stock

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Overview

Unlock unparalleled performance with the NVT2001GM from NXP Semiconductors, a trusted leader in innovative interface solutions. Designed for robust applications across various industries, this ultra-compact IC ensures reliability and efficiency, operating seamlessly even in extreme temperatures. Experience reduced design complexity and enhanced functionality, empowering your projects with higher quality and proven dependability—perfect for today's advanced electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and resistance to environmental factors, making the IC suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs, thus saving space and enabling more efficient board layouts.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this IC can safely interface with many common low-voltage systems, ensuring compatibility with a wide range of devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes the footprint for minimal space occupation on circuit boards while maintaining performance efficiency.

Maximum Supply Voltage-1: 5.5 V

Providing flexibility with a maximum voltage of 5.5 V accommodates various power supply configurations, making it versatile across different applications.

No. of Terminals: 6

The 6-terminal configuration supports a variety of connection possibilities, enhancing the IC's functionality in multiple circuit designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile are ideal for space-constrained applications, allowing for easier integration into modern electronics.

Minimum Supply Voltage-1: 1.8 V

A minimum supply voltage of 1.8 V enhances low voltage operation, suitable for battery-operated devices and energy-efficient designs.

Minimum Supply Voltage: 1 V

Operating at a minimum voltage of just 1 V makes this IC an excellent choice for ultra-low-power applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is reliable for industrial applications where temperature variations can be significant.

Minimum Operating Temperature: -40 °C

Its ability to operate down to -40 °C allows this IC to function properly in extreme environments, broadening its application range.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and is compliant with environmental regulations, ensuring reliable connections.

Terminal Position: DUAL

The dual terminal position aids in easy assembly and ensures better electrical performance through optimal layout configurations.

Maximum Seated Height: 0.5 mm

A maximum seated height of just 0.5 mm helps in achieving low-profile designs, facilitating the creation of compact solutions.

Width: 1 mm

At only 1 mm width, this IC is suitable for tight spaces, making it perfect for modern electronic designs with space limitations.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum exposure time of 30 seconds at peak reflow temperature minimizes thermal stress on the IC during soldering processes, ensuring durability.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature of 260 °C allows compatibility with most soldering processes, making it easier to integrate into production environments.

Length: 1.45 mm

The compact length of 1.45 mm further enhances the IC's usability in space-constrained applications without compromising performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature environments indicates robustness and reliability for use in demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the overall footprint and contributes to improved electrical performance, while also simplifying the manufacturing process.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this IC is designed for high-density connections, accommodating modern PCB designs that require close placement of components.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it is designed specifically for communication between different components, ensuring efficient data transfer in a variety of applications.

Technical Specifications

Other Function Interface ICs NVT2001GM attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also Required Vref(B) Supply 0 to 5.5V

Interface IC Type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NVT2001GM Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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