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NVT2002GM

NXP Semiconductors

NVT2002GM by NXP Semiconductors

NVT2002GM from NXP Semiconductors is a versatile interface IC designed for industrial applications. It operates within a supply voltage range of 0-5.5V and withstands temperatures from -40 °C to 85 °C. Its compact 8-terminal, very thin profile package ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,057 parts In-Stock

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4,057

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Digiode

USA . 3,998 parts In-Stock

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3,998

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Anansix

USA . 1,852 parts In-Stock

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1,852

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 371 parts In-Stock

1+ parts

$18.500

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371

$18.500

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Corphita

USA . 3,980 parts In-Stock

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3,980

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UNI Independent Distributors

Spain . 1,024 parts In-Stock

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Overview

Unlock seamless connectivity and superior performance with the NVT2002GM from NXP Semiconductors. Renowned for quality and innovation, NXP delivers this versatile interface IC designed for a range of applications, from industrial automation to consumer electronics. With robust temperature tolerance and a compact design, the NVT2002GM ensures reliability and efficiency, empowering your designs with unmatched value and performance. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice ensures durability and reliability in various environmental conditions, making it suitable for industrial applications.

Surface Mount: YES

The surface mount design facilitates easy integration into modern electronic circuit boards, saving space and cost during manufacturing.

Maximum Supply Voltage: 5.4 V

A moderate maximum supply voltage allows the IC to operate effectively in a wide range of applications without the risk of damage.

Package Shape: SQUARE

The square shape optimizes the layout and placement on PCB, improving design flexibility and efficiency.

Maximum Supply Voltage-1: 5.5 V

Having a slightly higher maximum supply voltage expands the application possibilities, accommodating different system requirements.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for various interface needs while keeping the package compact.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink capability enhance thermal management, making it a good choice for high-performance applications.

Minimum Supply Voltage-1: 0 V

With a minimum supply voltage of 0 V, this IC is capable of operating in low power and battery-powered applications efficiently.

Minimum Supply Voltage: 0 V

This feature allows for flexibility in power supply design, accommodating a range of operational environments and battery configurations.

Maximum Operating Temperature: 85 °C

Rated for a high maximum operating temperature, this IC is suitable for industrial applications where heat management is critical.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables this IC to function in extreme environments, ensuring reliability in harsh conditions.

Terminal Position: QUAD

The quad terminal position allows for streamlined connections which can enhance signal integrity and ease of routing on the PCB.

Maximum Seated Height: 0.5 mm

A low seated height makes it easier to integrate into compact designs while optimizing the overall profile of the device.

Width: 1.6 mm

With a narrow width, the IC is suitable for space-constrained applications, helping designers maximize the use of available board space.

Length: 1.6 mm

The compact length contributes to a smaller footprint, making it ideal for modern electronic devices with limited space.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures signifies robustness and suitability for tough environments, ensuring long-term reliability.

Terminal Form: NO LEAD

The no lead form simplifies manufacturing processes and reduces soldering issues, making it a practical choice for high-volume production.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense layouts on PCB, which is essential for advanced electronics in compact designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC enhances the interaction between different components of a system, improving overall performance and flexibility.

Technical Specifications

Other Function Interface ICs NVT2002GM attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also Required Vref(B) Supply 0 to 5.5V

Interface IC Type:

JESD-30 Code:

S-PQCC-N8

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

5.4 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

1.6 mm

Trade Compliance

NVT2002GM Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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