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NVT2002GD

NXP Semiconductors

NVT2002GD by NXP Semiconductors

NVT2002GD by NXP Semiconductors is a dual interface IC with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 85 °C. It features an ultra-thin profile (0.5mm height) and is ideal for compact electronic applications. Its surface mount design ensures efficient integration into various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Flip Electronics

USA . 6,000 parts In-Stock

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Vyrian

USA . 3,842 parts In-Stock

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Digiode

USA . 3,254 parts In-Stock

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Anansix

USA . 1,782 parts In-Stock

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Sunrise Surplus Inc.

USA . 352 parts In-Stock

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One Stop Electronics

USA . 232 parts In-Stock

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$45.500

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UNI Independent Distributors

Spain . 6,136 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,279 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,267 parts In-Stock

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Corphita

USA . 396 parts In-Stock

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Overview

Elevate your designs with the NVT2002GD from NXP Semiconductors—a leader in high-quality interface solutions. This compact, robust IC is engineered for versatility across diverse applications, ensuring reliable performance even in demanding conditions. With a wide operating voltage range and industrial-grade durability, it empowers your projects with unmatched efficiency and longevity. Experience the NXP advantage; where innovation meets excellence, giving you the tools to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and reliability of the component, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and facilitates automated assembly, reducing production costs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V is suitable for low-power applications, making it energy efficient.

Package Shape: RECTANGULAR

The rectangular package shape aids in compact design and efficient use of PCB real estate.

Maximum Supply Voltage-1: 5.5 V

The extended maximum voltage tolerance provides flexibility for applications with varying voltage requirements.

No. of Terminals: 8

Having 8 terminals allows for multiple interface connections, providing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small, thin profile minimizes space consumption while allowing for high-performance applications.

Minimum Supply Voltage-1: 1.8 V

A minimum supply voltage of 1.8 V makes this IC suitable for battery-operated devices, enhancing its range of use.

Minimum Supply Voltage: 1 V

This low minimum voltage enables operation in energy-sensitive environments, accommodating a broader range of applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability in demanding industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures functionality in extreme conditions, making it ideal for outdoor or harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This premium terminal finish provides excellent corrosion resistance and enhances solderability, ensuring robust connections.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible layout and design in circuit boards, improving overall integration.

Maximum Seated Height: 0.5 mm

A low seated height allows for a compact design, which is critical in modern electronic devices where size is a constraint.

Width: 2 mm

A compact width facilitates easy integration into space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peaking time reduces the risk of thermal damage during assembly, ensuring the integrity of the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures compatibility with lead-free soldering processes, meeting modern manufacturing standards.

Length: 3 mm

The short length contributes to a compact overall design, perfect for portable and space-sensitive electronics.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness and reliability in critical applications, establishing trust with consumers.

Terminal Form: NO LEAD

A no-lead terminal form minimizes PCB footprint and enhances soldering efficiency, promoting design flexibility.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows more terminals within a smaller area, accommodating higher density designs.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this IC is perfect for connecting disparate systems, enhancing communication and functionality in electronic designs.

Technical Specifications

Other Function Interface ICs NVT2002GD attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also Required Vref(B) Supply 0 to 5.5V

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NVT2002GD Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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