Loading...

PCA9525DP,118

NXP Semiconductors

PCA9525DP,118 by NXP Semiconductors

PCA9525DP,118 from NXP Semiconductors is a CMOS interface IC designed for industrial applications. It operates at 3/5V with an extended temp range of -40 °C to 85 °C and features an 8-terminal gull-wing package. Ideal for surface mount designs, it supports efficient communication in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,117

-

-

-

-

Anansix

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

552

-

-

-

-

Digiode

USA . 140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 718 parts In-Stock

1+ parts

$13.860

100+ parts

-

1k+ parts

-

10k+ parts

-

718

$13.860

-

-

-

One Stop Electronics

USA . 1,158 parts In-Stock

1+ parts

$33.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,158

$33.500

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,659

-

-

-

-

Corphita

USA . 4,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,202

-

-

-

-

Microchip USA

USA . 3,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,962

-

-

-

-

UNI Independent Distributors

Spain . 462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

462

-

-

-

-

Overview

Unlock the power of seamless communication in your designs with the PCA9525DP,118 from NXP Semiconductors. Renowned for their cutting-edge technology and unwavering quality, NXP delivers this versatile interface IC, perfect for industrial applications where reliability is paramount. With its compact footprint and robust performance across temperature extremes, you’ll experience enhanced efficiency and design flexibility—ideal for modern electronics. Elevate your projects with NXP's trusted innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mounting allows for a compact design and efficient use of board space, ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier placement on PCBs and optimizes space within the circuit layout.

Power Supplies (V): 3/5

Dual power supply voltage options (3V and 5V) enhance flexibility, allowing for compatibility with a wide range of systems.

No. of Terminals: 8

With 8 terminals, the IC offers sufficient connectivity for various functionalities while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile reduce board space requirements, which is crucial for miniaturized electronic applications.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, this IC can perform reliably in moderately harsh environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows for use in extreme cold conditions, making it suitable for industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning increases layout flexibility on the PCB, which can aid in design efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds helps prevent damage during manufacturing, ensuring a robust end product.

Peak Reflow Temperature °C: 260

The high reflow temperature of 260 °C is standard for modern soldering processes, ensuring compatibility with lead-free soldering techniques.

Temperature Grade: INDUSTRIAL

Being industrial-grade means this IC is built to endure rigorous conditions, enhancing its reliability in demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making this IC an excellent choice for power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability as well as easier soldering, making assembly more efficient.

Terminal Pitch: 0.635 mm

With a fine terminal pitch of 0.635 mm, this IC is suitable for high-density applications, maximizing the use of available space.

Technical Specifications

Other Function Interface ICs PCA9525DP,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PCA9525DP,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20