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STCC08RL

STMicroelectronics

STCC08RL by STMicroelectronics

STCC08RL by STMicroelectronics is an 8-terminal interface IC with power supplies of 3.3/5V, operating temperature range of -20 to 85 °C, and terminal finish in nickel palladium gold. It is a small outline package suitable for surface mount applications in various electronic devices requiring interface circuitry.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,654

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-

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Anansix

USA . 2,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,860

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-

-

-

Digiode

USA . 1,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,266

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,016 parts In-Stock

1+ parts

$5.426

100+ parts

-

1k+ parts

$4.884

10k+ parts

-

2,016

$5.426

-

$4.884

-

Microchip USA

USA . 444 parts In-Stock

1+ parts

$6.748

100+ parts

-

1k+ parts

-

10k+ parts

-

444

$6.748

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-

-

MKK Technologies

India . 2,059 parts In-Stock

1+ parts

$10.204

100+ parts

-

1k+ parts

-

10k+ parts

-

2,059

$10.204

-

-

-

DigiPath Technology Company

USA . 2,059 parts In-Stock

1+ parts

$10.204

100+ parts

-

1k+ parts

-

10k+ parts

-

2,059

$10.204

-

-

-

AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$16.060

100+ parts

-

1k+ parts

-

10k+ parts

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478

$16.060

-

-

-

Corphita

USA . 2,986 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,986

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Vigor

Singapore . 1,413 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,413

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-

-

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Parana Technologies

USA . 875 parts In-Stock

1+ parts

-

100+ parts

$6.488

1k+ parts

-

10k+ parts

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875

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$6.488

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-

Overview

Unlock the potential of your electronic devices with the STCC08RL by STMicroelectronics. This high-quality interface IC offers unparalleled performance and reliability, thanks to its reputable manufacturer. Whether you're designing consumer electronics, industrial equipment, or automotive systems, this versatile component provides seamless connectivity and optimal functionality. Elevate your projects with the STCC08RL and experience the value and benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Power Supplies (V): 3.3/5

The product can work with multiple power supply voltages, offering flexibility in different electronic systems.

No. of Terminals: 8

Having multiple terminals enables the product to interface with other components or devices, increasing its functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the PCB, especially in compact electronic designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding operating conditions without performance degradation.

Minimum Operating Temperature: -20 °C

The ability to operate in low temperatures makes the product suitable for use in diverse environments, ensuring reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and ensures a long-lasting connection.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process effectively without damage.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the product's performance.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring a reliable electrical connection.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on the PCB, enabling more functionality in limited space.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, the product facilitates communication between different electronic components, making it a key component in system integration.

Technical Specifications

Other Function Interface ICs STCC08RL attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

STCC08RL Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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