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XAM3874BCYE

Texas Instruments

XAM3874BCYE by Texas Instruments

XAM3874BCYE by Texas Instruments is a 32-bit RISC microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power applications. The package style is grid array, fine pitch, making it ideal for compact designs in various electronic devices.

Median Price

$43.240

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43 parts In-Stock

1+ parts

$43.240

100+ parts

$42.380

1k+ parts

$41.510

10k+ parts

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43

$43.240

$42.380

$41.510

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,572 parts In-Stock

1+ parts

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5,572

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Digiode

USA . 2,139 parts In-Stock

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2,139

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ComSIT Distribution GmbH

Germany . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 389 parts In-Stock

1+ parts

$12.000

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-

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389

$12.000

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AZTECH Wire

Italy . 378 parts In-Stock

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$13.554

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378

$13.554

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Parana Technologies

USA . 604 parts In-Stock

1+ parts

$74.477

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604

$74.477

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ChromeModa Solutions

Germany . 6,591 parts In-Stock

1+ parts

$83.682

100+ parts

$68.619

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6,591

$83.682

$68.619

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IDEA Electronic Components Group

UK . 726 parts In-Stock

1+ parts

$83.682

100+ parts

$79.498

1k+ parts

$75.314

10k+ parts

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726

$83.682

$79.498

$75.314

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DigiPath Technology Company

USA . 1,361 parts In-Stock

1+ parts

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$75.448

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1,361

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Corphita

USA . 1,181 parts In-Stock

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Microchip USA

USA . 129 parts In-Stock

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129

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Overview

Experience unparalleled performance and reliability with the XAM3874BCYE microprocessor by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in every product they release. Ideal for a variety of applications, this microprocessor offers seamless integration, advanced features, and efficient processing power. Elevate your projects to the next level with the XAM3874BCYE and enjoy the superior value, benefits, and advantages that only Texas Instruments can provide. Trust in Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and offers good thermal properties, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache can improve performance by reducing the time it takes for the processor to access frequently used data.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting of the processor onto a circuit board, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power management, ensuring stable performance under varying conditions.

Address Bus Width: 28

Having a wider address bus allows for larger memory addressing capabilities and more efficient data transfer within the processor.

Package Shape: SQUARE

A square package shape is easy to handle and provides better thermal dissipation, contributing to the overall reliability of the product.

Bit Size: 32

A 32-bit architecture enables the processor to handle larger chunks of data at once, improving processing speed and efficiency.

No. of Terminals: 684

Having a high number of terminals allows for more connectivity options and versatile integration into complex electronic systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensures accurate and reliable connection points, enhancing the overall performance of the processor.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage helps to conserve power and extend battery life in mobile devices or other low-power applications.

Terminal Position: BOTTOM

Bottom terminal positioning makes it easier to solder and connect the processor, simplifying the assembly process for manufacturers.

Maximum Seated Height: 3.06 mm

The relatively low maximum seated height allows for a compact design, enabling the processor to be used in space-constrained applications.

Width: 23 mm

The moderate width of the processor makes it compatible with standard mounting configurations and ensures a good balance of performance and form factor.

Boundary Scan: YES

Boundary scan capability aids in testing, diagnosing, and debugging the processor during production, helping to ensure high quality and reliability.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient data transfer to and from external memory or other peripherals, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency enables fast data processing and execution of instructions, making the processor suitable for demanding applications.

Length: 23 mm

The compact length of the processor makes it easy to fit into various electronic devices without taking up too much space.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, the product offers simplified instruction set architectures, leading to high performance and efficiency in processing tasks.

Technology: CMOS

CMOS technology is known for its low power consumption, high noise immunity, and compatibility with a wide range of applications, making the processor energy-efficient and versatile.

Terminal Form: BALL

The use of ball terminals simplifies the installation and connection process, ensuring a reliable and durable interface for the processor.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage strikes a balance between power optimization and performance, ensuring efficient operation in various usage scenarios.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density packaging and improved signal integrity, facilitating robust connectivity in complex electronic systems.

Format: FLOATING POINT

Supporting floating-point operations enhances the processor's ability to perform complex mathematical calculations with greater precision and efficiency.

Low Power Mode: YES

The availability of a low power mode helps reduce energy consumption during idle or low-demand periods, contributing to overall energy efficiency and extended battery life.

Technical Specifications

Microprocessors XAM3874BCYE attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

684

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.06 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XAM3874BCYE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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