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TNETV2666INZWT

Texas Instruments

TNETV2666INZWT by Texas Instruments

TNETV2666INZWT by Texas Instruments is a DSP with 32-bit external data bus, 30 MHz clock frequency, and 13-bit address bus width. Ideal for digital signal processing applications requiring low power mode, it features a package style of grid array with 361 terminals in a square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,788 parts In-Stock

1+ parts

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8,788

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Digiode

USA . 4,896 parts In-Stock

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4,896

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 560 parts In-Stock

1+ parts

$4.000

100+ parts

-

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560

$4.000

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AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$12.508

100+ parts

-

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541

$12.508

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One Stop Electronics

USA . 459 parts In-Stock

1+ parts

$20.000

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459

$20.000

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Parana Technologies

USA . 1,727 parts In-Stock

1+ parts

$41.862

100+ parts

$3,887.525

1k+ parts

$37.676

10k+ parts

-

1,727

$41.862

$3,887.525

$37.676

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DigiPath Technology Company

USA . 1,611 parts In-Stock

1+ parts

$46.095

100+ parts

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1k+ parts

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10k+ parts

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1,611

$46.095

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ChromeModa Solutions

Germany . 1,668 parts In-Stock

1+ parts

$47.036

100+ parts

$38.570

1k+ parts

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10k+ parts

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1,668

$47.036

$38.570

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IDEA Electronic Components Group

UK . 1,361 parts In-Stock

1+ parts

$47.036

100+ parts

$44.684

1k+ parts

$42.332

10k+ parts

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1,361

$47.036

$44.684

$42.332

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Corohmni

South Africa . 289 parts In-Stock

1+ parts

$76.387

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289

$76.387

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Corphita

USA . 3,485 parts In-Stock

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3,485

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Overview

Experience cutting-edge technology with the TNETV2666INZWT by Texas Instruments, a leading manufacturer of top-of-the-line Digital Signal Processors. This versatile DSP offers seamless integration, high performance, and low power consumption, making it ideal for a wide range of applications. Whether you're in telecommunications, audio processing, or industrial automation, this compact and reliable solution delivers unparalleled value and efficiency. Upgrade your systems today with the TNETV2666INZWT and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects internal components from external damage.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into a variety of electronic devices.

Maximum Supply Voltage: 1.26 V

High maximum supply voltage ensures stable performance under varying power conditions.

Address Bus Width: 13

Wide address bus width enables efficient data processing and memory access.

Package Shape: SQUARE

Square package shape facilitates compact design and easy placement on circuit boards.

No. of Terminals: 361

Higher number of terminals allow for more connections and functionality in the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style optimize PCB layout and enhance signal processing capabilities.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage helps in reducing power consumption and increasing efficiency.

Maximum Operating Temperature: 90 °C

High maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for versatile use in different temperature settings.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance for long-lasting use.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and connection with other components.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables slim and compact device designs.

Width: 16 mm

Compact width allows for efficient use of space on a circuit board.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the DSP for improved reliability.

External Data Bus Width: 32

Wide external data bus width enhances data processing speed and efficiency.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency enables fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and durability of the DSP.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing capabilities within the DSP.

Length: 16 mm

Compact length contributes to the overall small footprint of the DSP on a circuit board.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC types allow for diverse functionality and application possibilities.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for efficient data processing.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable performance in electronic devices.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the DSP.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for dense packing and efficient use of space on a circuit board.

Format: FIXED POINT

Fixed-point format enhances computational efficiency and accuracy in signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard assembly and handling processes.

Low Power Mode: YES

Low power mode option helps in conserving energy and extending the battery life of devices powered by the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2666INZWT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2666INZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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