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TMX320F2808GGMA

Texas Instruments

TMX320F2808GGMA by Texas Instruments

TMX320F2808GGMA by Texas Instruments is a 32-bit DSP with 100 terminals, operating at up to 100 MHz. It features low power mode, boundary scan, and CMOS technology. Ideal for industrial applications requiring high-speed digital signal processing in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,570 parts In-Stock

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6,570

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Digiode

USA . 2,097 parts In-Stock

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2,097

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Distributors (Availability)

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AZTECH Wire

Italy . 805 parts In-Stock

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$11.116

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805

$11.116

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Advanced Electronics

New Zealand . 338 parts In-Stock

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$12.354

100+ parts

$12.230

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$11.736

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338

$12.354

$12.230

$11.736

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One Stop Electronics

USA . 459 parts In-Stock

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$26.000

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459

$26.000

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Corohmni

South Africa . 3,049 parts In-Stock

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$65.582

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3,049

$65.582

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Parana Technologies

USA . 820 parts In-Stock

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$72.639

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820

$72.639

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DigiPath Technology Company

USA . 705 parts In-Stock

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$79.985

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705

$79.985

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ChromeModa Solutions

Germany . 4,098 parts In-Stock

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$81.617

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$66.926

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4,098

$81.617

$66.926

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IDEA Electronic Components Group

UK . 1,650 parts In-Stock

1+ parts

$81.617

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$77.536

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$73.455

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1,650

$81.617

$77.536

$73.455

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Corphita

USA . 3,743 parts In-Stock

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Microchip USA

USA . 438 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMX320F2808GGMA DSP by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This versatile processor is perfect for a wide range of applications, providing unmatched performance and efficiency. Whether you're looking to enhance your audio systems, control motors, or optimize energy management, this DSP offers unparalleled value and benefits. Elevate your projects with the TMX320F2808GGMA and experience the difference of Texas Instruments innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications while keeping costs low.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and labor costs during production.

Maximum Supply Voltage: 1.89 V

With a relatively low maximum supply voltage, this DSP can operate efficiently while consuming less power, making it energy efficient.

Package Shape: SQUARE

The square shape allows for easy placement on the PCB, optimizing space utilization and layout design.

Bit Size: 32

A 32-bit architecture provides high processing capability, making the product suitable for complex signal processing tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supplies allows for flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 100

Having 100 terminals enables connectivity with other components and peripherals, enhancing the product's functionality and versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact form factor, efficient heat dissipation, and high signal integrity, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures operation at lower power levels, reducing energy consumption and heat dissipation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions, ensuring reliable performance in industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for use in extreme cold environments without compromising performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier PCB layout and assembly, optimizing space utilization and simplifying manufacturing processes.

Maximum Seated Height: 1.4 mm

A low seated height allows for a compact design, reducing the overall profile of the product and enabling space-saving integration in tight spaces.

RAM Words: 18432

With a large amount of RAM words, the DSP can store and process a significant amount of data, enabling efficient signal processing operations.

Width: 10 mm

A compact width dimension allows for efficient board space utilization, enabling the integration of multiple components in a limited space.

Boundary Scan: YES

Boundary scan capability helps in testing and debugging the product during manufacturing, ensuring high quality and reliability in the final product.

Maximum Clock Frequency: 100 MHz

A high maximum clock frequency enables fast data processing and signal handling, making the product suitable for real-time applications.

Internal Bus Architecture: MULTIPLE

Support for multiple internal bus architectures enhances data transfer efficiency and enables simultaneous execution of multiple operations, improving overall processing speed.

Length: 10 mm

A compact length dimension allows for efficient board space utilization, enabling the integration of multiple components in a limited space.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, the product can withstand harsh environmental conditions, ensuring reliable operation in demanding applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Combining digital signal processing capabilities with additional peripheral functions expands the product's utility and applicability in diverse applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high integration density, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form simplifies the soldering process, ensuring reliable electrical connections and improving the overall durability of the product.

Nominal Supply Voltage: 1.8 V

A consistent nominal supply voltage ensures stable operation and reliable performance, preventing voltage fluctuations that could impact signal processing.

Terminal Pitch: 0.8 mm

A small terminal pitch allows for high-density mounting, enabling the integration of multiple components in a compact space.

Format: FIXED POINT

Using fixed-point format simplifies arithmetic operations and improves processing speed, making the product efficient for a wide range of signal processing tasks.

Low Power Mode: YES

Support for low power mode enables energy-efficient operation, prolonging battery life in portable devices and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMX320F2808GGMA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

Length:

10 mm

Low Power Mode:

YES

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

18432

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMX320F2808GGMA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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