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TMS34020-32GB

Texas Instruments

TMS34020-32GB by Texas Instruments

TMS34020-32GB by Texas Instruments is a graphics processor with 144 terminals, operating at 0-70°C. It has a supply voltage of 5V and max current of 250mA. Ideal for commercial applications requiring high-performance GPUs in a square ceramic package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,865 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,865

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Digiode

USA . 1,434 parts In-Stock

1+ parts

-

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-

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1,434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,366 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,366

$10.000

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AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$10.862

100+ parts

-

1k+ parts

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10k+ parts

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336

$10.862

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Corohmni

South Africa . 2,740 parts In-Stock

1+ parts

$28.820

100+ parts

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2,740

$28.820

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Parana Technologies

USA . 2,295 parts In-Stock

1+ parts

$42.111

100+ parts

$3,910.667

1k+ parts

$37.900

10k+ parts

-

2,295

$42.111

$3,910.667

$37.900

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

$46.370

100+ parts

$42.660

1k+ parts

-

10k+ parts

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1,334

$46.370

$42.660

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IDEA Electronic Components Group

UK . 2,135 parts In-Stock

1+ parts

$47.316

100+ parts

$44.950

1k+ parts

$42.584

10k+ parts

-

2,135

$47.316

$44.950

$42.584

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ChromeModa Solutions

Germany . 1,746 parts In-Stock

1+ parts

$47.316

100+ parts

$38.799

1k+ parts

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10k+ parts

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1,746

$47.316

$38.799

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Corphita

USA . 1,975 parts In-Stock

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1,975

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Overview

Elevate your graphics processing capabilities with the TMS34020-32GB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This Graphics Processor Unit (GPU) is perfect for a wide range of applications, from gaming to data visualization. With a power supply of 5V and a maximum supply current of 250mA, this product offers exceptional performance while maintaining a commercial temperature grade. Experience seamless graphics processing with the TMS34020-32GB and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal performance, making it ideal for high-power graphics processors.

Power Supplies (V): 5

Operates on a standard voltage of 5V, making it compatible with most systems and easy to integrate.

No. of Terminals: 144

High number of terminals allow for complex connections and efficient data transfer within the GPU.

Maximum Operating Temperature: 70 °C

Capable of operating at high temperatures without performance degradation, ensuring stable performance under heavy loads.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the GPU energy-efficient and reliable.

Technical Specifications

Graphics Processors (GPUs) TMS34020-32GB attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

250 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

TMS34020-32GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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