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SMJ34010-40GB

Texas Instruments

SMJ34010-40GB by Texas Instruments

Texas Instruments' SMJ34010-40GB is a military-grade graphics processor with 68 terminals, operating b/w -55°C to 125°C. It requires 5V supply voltage and draws a max current of 125mA. Ideal for applications needing high-performance GPUs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,854 parts In-Stock

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9,854

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Digiode

USA . 640 parts In-Stock

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640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 430 parts In-Stock

1+ parts

$5.004

100+ parts

-

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430

$5.004

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One Stop Electronics

USA . 1,470 parts In-Stock

1+ parts

$27.000

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1,470

$27.000

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Parana Technologies

USA . 1,887 parts In-Stock

1+ parts

$60.960

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1,887

$60.960

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Corohmni

South Africa . 969 parts In-Stock

1+ parts

$63.974

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969

$63.974

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ChromeModa Solutions

Germany . 3,835 parts In-Stock

1+ parts

$68.494

100+ parts

$56.165

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3,835

$68.494

$56.165

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IDEA Electronic Components Group

UK . 1,176 parts In-Stock

1+ parts

$68.494

100+ parts

$65.069

1k+ parts

$61.645

10k+ parts

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1,176

$68.494

$65.069

$61.645

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Corphita

USA . 3,296 parts In-Stock

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3,296

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DigiPath Technology Company

USA . 823 parts In-Stock

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$61.754

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823

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$61.754

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Overview

Enhance your graphics processing capabilities with the SMJ34010-40GB by Texas Instruments. Known for their top-quality products, Texas Instruments delivers cutting-edge technology in the form of this GPU, perfect for a wide range of applications. Whether you're a gamer, designer, or professional in need of high-performance graphics, this product offers unmatched value, benefits, and advantages. Experience seamless graphics rendering, improved efficiency, and increased productivity with the SMJ34010-40GB. Elevate your experience today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides better thermal conductivity and durability, making the GPU suitable for high-performance applications.

Package Shape: SQUARE

Square package shape allows for efficient and compact placement on the circuit board, optimizing space utilization.

Power Supplies (V): 5

Operates at a standard 5V power supply, ensuring compatibility with most systems and reducing the need for additional power source configurations.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this GPU can withstand high heat environments without compromising performance.

Peripheral IC Type: GRAPHICS PROCESSOR

Built specifically as a graphics processor, this GPU is designed to handle complex visual calculations and optimizations, making it ideal for graphics-intensive tasks.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, contributing to energy efficiency and overall performance of the GPU.

Technical Specifications

Graphics Processors (GPUs) SMJ34010-40GB attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P68

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Graphics Processors

Maximum Supply Current:

125 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

SMJ34010-40GB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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