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SMJ34010-50GB

Texas Instruments

SMJ34010-50GB by Texas Instruments

SMJ34010-50GB by Texas Instruments is a military-grade graphics processor with 68 terminals, operating b/w -55°C to 125°C. It requires 5V supply voltage and draws a max current of 150mA. Ideal for high-performance applications in extreme environments due to its CMOS technology and ceramic package body material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,841 parts In-Stock

1+ parts

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4,841

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Digiode

USA . 1,789 parts In-Stock

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1,789

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 867 parts In-Stock

1+ parts

$4.000

100+ parts

-

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867

$4.000

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AZTECH Wire

Italy . 357 parts In-Stock

1+ parts

$15.539

100+ parts

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357

$15.539

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Parana Technologies

USA . 2,006 parts In-Stock

1+ parts

$57.327

100+ parts

$5,323.652

1k+ parts

$51.594

10k+ parts

-

2,006

$57.327

$5,323.652

$51.594

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DigiPath Technology Company

USA . 1,111 parts In-Stock

1+ parts

$63.124

100+ parts

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1,111

$63.124

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ChromeModa Solutions

Germany . 6,102 parts In-Stock

1+ parts

$64.412

100+ parts

$52.818

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6,102

$64.412

$52.818

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IDEA Electronic Components Group

UK . 1,367 parts In-Stock

1+ parts

$64.412

100+ parts

$61.191

1k+ parts

$57.971

10k+ parts

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1,367

$64.412

$61.191

$57.971

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Corohmni

South Africa . 458 parts In-Stock

1+ parts

$80.754

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458

$80.754

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Corphita

USA . 758 parts In-Stock

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758

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Overview

Revolutionize your graphics processing capabilities with the SMJ34010-50GB by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers a cutting-edge graphics processor that offers unmatched performance in a variety of applications. Whether you're a gaming enthusiast, a professional designer, or a tech-savvy consumer, this GPU provides value, benefits, and advantages that will take your visual experience to the next level. Upgrade your system today with the SMJ34010-50GB and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides enhanced durability and thermal properties, making the GPU more resistant to heat and mechanical stress.

Power Supplies (V): 5

Operating at a power supply of 5V allows for compatibility with a wide range of systems and ensures stable performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this GPU can withstand high levels of heat while maintaining reliable operation.

Peripheral IC Type: GRAPHICS PROCESSOR

Designed specifically as a graphics processor, this GPU is optimized for graphic-intensive tasks and provides high-quality rendering and visual performance.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption and high speed processing, making this GPU energy efficient and performance-optimized.

Technical Specifications

Graphics Processors (GPUs) SMJ34010-50GB attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P68

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Graphics Processors

Maximum Supply Current:

150 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

SMJ34010-50GB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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