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EF9366P

STMicroelectronics

EF9366P by STMicroelectronics

STMicroelectronics EF9366P is a 40-terminal GPU with 5V power supply, operating b/w 0-70 °C. Ideal for graphics processing applications, it features MOS technology, tin lead finish, and through-hole terminals in a rectangular plastic package.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,791 parts In-Stock

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3,791

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Vyrian

USA . 2,987 parts In-Stock

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2,987

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Anansix

USA . 631 parts In-Stock

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631

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Tectiva GmbH

Germany . 156 parts In-Stock

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156

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Huijzer Components

Netherlands . 18 parts In-Stock

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ComSIT Distribution GmbH

Germany . 16 parts In-Stock

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16

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Fibra_Brandt Electronic GMBH

Germany . 9 parts In-Stock

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9

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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ECAB

Sweden . 8 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,932 parts In-Stock

1+ parts

$42.283

100+ parts

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2,932

$42.283

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IDEA Electronic Components Group

UK . 497 parts In-Stock

1+ parts

$66.958

100+ parts

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$60.262

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497

$66.958

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$60.262

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MKK Technologies

India . 1,441 parts In-Stock

1+ parts

$125.909

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1,441

$125.909

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DigiPath Technology Company

USA . 1,441 parts In-Stock

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$125.909

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1,441

$125.909

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Corphita

USA . 3,387 parts In-Stock

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3,387

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Parana Technologies

USA . 1,475 parts In-Stock

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$80.058

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1,475

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$80.058

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Native Components

USA . 649 parts In-Stock

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$3.205

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649

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$3.205

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Northwest PG Solutions

USA . 379 parts In-Stock

1+ parts

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$3.238

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379

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$3.238

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Assy Fe

Spain . 62 parts In-Stock

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62

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Overview

Unleash the power of cutting-edge graphics processing with the EF9366P by STMicroelectronics. Crafted with precision and expertise, this GPU offers unrivaled performance and reliability for a wide range of applications. From gaming to virtual reality, this GPU delivers seamless graphics rendering, immersive experiences, and unparalleled visual quality. Elevate your projects with the EF9366P and experience the difference that superior technology can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material allows for lightweight and durable packaging, making the GPU easy to handle and resistant to damage.

Package Shape: RECTANGULAR

The rectangular shape is a standard form factor for GPUs, ensuring compatibility with a wide range of computer systems and motherboards.

Power Supplies (V): 5

Operating at a low voltage of 5V, this GPU is energy efficient and helps reduce power consumption in a computer system.

No. of Terminals: 40

With 40 terminals, this GPU provides ample connectivity options and interfaces for seamless integration with other components in a computer system.

Package Style (Meter): IN-LINE

The in-line package style helps in easy installation and space-saving design, making it suitable for compact computer systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this GPU can perform efficiently even under heavy workloads and demanding gaming sessions.

Minimum Operating Temperature: 0 °C

The GPU can operate smoothly even at low temperatures, ensuring consistent performance and reliability in various environmental conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability, ensuring stable connections and reliable performance of the GPU.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and connection, enabling compatibility with different types of computer systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the GPU is designed for standard operating conditions in commercial applications, offering reliable performance and longevity.

Peripheral IC Type: GRAPHICS PROCESSOR

Being a graphics processor, this GPU is optimized for handling graphics-intensive tasks such as gaming, video editing, and image processing, providing high-quality visual output.

Technology: MOS

The MOS technology used in this GPU ensures efficient power management and high-speed operation, delivering superior performance for demanding computing tasks.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure mounting and reliable connections, making the GPU suitable for rugged environments and long-term use.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this GPU is compatible with standard power sources and offers stable performance in various computer systems.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch provides adequate spacing for easy soldering and assembly, ensuring a secure and reliable connection of the GPU in a computer system.

Technical Specifications

Graphics Processors (GPUs) EF9366P attributes and parameters. Explore more Graphics Processors (GPUs) devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e0

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

EF9366P Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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