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5962-9072701MYA

Texas Instruments

5962-9072701MYA by Texas Instruments

The Texas Instruments 5962-9072701MYA is a military-grade graphics processor with 16-bit external data bus, operating at up to 40 MHz. It features a ceramic, metal-sealed co-fired package body and operates b/w -55°C to 125°C. Ideal for applications requiring high-performance graphics processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,751 parts In-Stock

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3,751

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Digiode

USA . 3,602 parts In-Stock

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3,602

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Distributors (Availability)

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$13.322

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351

$13.322

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One Stop Electronics

USA . 263 parts In-Stock

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$16.000

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263

$16.000

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Parana Technologies

USA . 1,159 parts In-Stock

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$58.855

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$58.855

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DigiPath Technology Company

USA . 1,477 parts In-Stock

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$64.806

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1,477

$64.806

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Corohmni

South Africa . 1,997 parts In-Stock

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$65.192

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1,997

$65.192

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ChromeModa Solutions

Germany . 3,430 parts In-Stock

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$66.129

100+ parts

$54.226

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3,430

$66.129

$54.226

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IDEA Electronic Components Group

UK . 129 parts In-Stock

1+ parts

$66.129

100+ parts

$62.823

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$59.516

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129

$66.129

$62.823

$59.516

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Corphita

USA . 1,052 parts In-Stock

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1,052

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Northwest PG Solutions

USA . 972 parts In-Stock

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972

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Native Components

USA . 110 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the Texas Instruments 5962-9072701MYA graphics processor. Crafted with precision and expertise by a trusted manufacturer, this GPU offers cutting-edge technology for a wide range of applications. From high-definition video rendering to complex simulations, this product delivers exceptional value and benefits to customers seeking top-tier graphics processing power. Upgrade your systems with the best in class and unlock endless possibilities with the 5962-9072701MYA by Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination ensures durability and longevity of the GPU, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.5 V

Having a high maximum supply voltage allows for flexibility in power input, making the GPU compatible with a variety of systems.

Screening Level: 38535Q/M;38534H;883B

This high screening level ensures that the GPU meets stringent quality standards, guaranteeing optimal performance and reliability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this GPU can withstand intense usage and maintain performance under challenging conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this GPU energy-efficient and capable of handling demanding graphics tasks.

Technical Specifications

Graphics Processors (GPUs) 5962-9072701MYA attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-N68

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC68,.95SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Graphics Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

5962-9072701MYA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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