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5962-9072701MXX

Texas Instruments

5962-9072701MXX by Texas Instruments

The Texas Instruments 5962-9072701MXX is a military-grade graphics processor with CMOS technology. It operates b/w -55 to 125 °C, with a max clock frequency of 40 MHz and supports up to 16 bits per pixel. Ideal for applications requiring high-performance GPUs in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,506 parts In-Stock

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4,506

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Vyrian

USA . 2,770 parts In-Stock

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2,770

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Distributors (Availability)

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AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$11.251

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500

$11.251

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One Stop Electronics

USA . 1,332 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 1,587 parts In-Stock

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$51.793

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$51.793

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ChromeModa Solutions

Germany . 3,242 parts In-Stock

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$58.194

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$47.719

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3,242

$58.194

$47.719

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IDEA Electronic Components Group

UK . 201 parts In-Stock

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$58.194

100+ parts

$55.284

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$52.375

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201

$58.194

$55.284

$52.375

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Corohmni

South Africa . 500 parts In-Stock

1+ parts

$81.772

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$81.772

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Corphita

USA . 1,411 parts In-Stock

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DigiPath Technology Company

USA . 1,199 parts In-Stock

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$52.468

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$52.468

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Native Components

USA . 637 parts In-Stock

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Northwest PG Solutions

USA . 178 parts In-Stock

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Overview

Elevate your graphics processing capabilities with the 5962-9072701MXX by Texas Instruments. This high-quality GPU offers unmatched performance and reliability, backed by the renowned manufacturer's reputation for excellence. Ideal for a wide range of applications, this product delivers exceptional value, benefits, and advantages to customers seeking top-of-the-line graphics processing solutions. Upgrade your system today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the graphics processor, ensuring longevity and reliability in various environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for efficient power delivery to the graphics processor, supporting its performance capabilities.

Screening Level: MIL-STD-883 Class B

This high screening level ensures that the graphics processor meets stringent military standards for quality and reliability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this graphics processor can withstand elevated temperatures without compromising performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency enables fast processing speeds and responsiveness, making this graphics processor suitable for demanding applications.

Technology: CMOS

Utilizing CMOS technology ensures energy efficiency and low power consumption, contributing to the overall efficiency of the graphics processor.

Technical Specifications

Graphics Processors (GPUs) 5962-9072701MXX attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CPGA-P68

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

5962-9072701MXX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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