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5962-9162302MXX

Texas Instruments

5962-9162302MXX by Texas Instruments

The Texas Instruments 5962-9162302MXX is a military-grade graphics processor with 32-bit external data bus width and max clock frequency of 32 MHz. It operates b/w -55 to 125 °C, suitable for high-performance applications requiring high-speed graphics processing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,372 parts In-Stock

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5,372

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Digiode

USA . 4,042 parts In-Stock

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4,042

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,058 parts In-Stock

1+ parts

$13.000

100+ parts

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1,058

$13.000

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AZTECH Wire

Italy . 719 parts In-Stock

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$16.618

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719

$16.618

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Parana Technologies

USA . 58 parts In-Stock

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$53.485

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58

$53.485

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ChromeModa Solutions

Germany . 1,255 parts In-Stock

1+ parts

$60.095

100+ parts

$49.278

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1,255

$60.095

$49.278

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IDEA Electronic Components Group

UK . 462 parts In-Stock

1+ parts

$60.095

100+ parts

$57.090

1k+ parts

$54.086

10k+ parts

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462

$60.095

$57.090

$54.086

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Corphita

USA . 3,204 parts In-Stock

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3,204

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Northwest PG Solutions

USA . 2,003 parts In-Stock

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2,003

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DigiPath Technology Company

USA . 1,455 parts In-Stock

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$54.182

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1,455

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$54.182

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Native Components

USA . 146 parts In-Stock

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146

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Overview

Elevate your visual experience with the 5962-9162302MXX by Texas Instruments. Crafted with precision using top-quality materials, this graphics processor offers unparalleled performance in military-grade applications. Seamlessly integrating into any system, this GPU delivers crisp graphics and smooth processing at a maximum clock frequency of 32 MHz. Unlock a new level of efficiency and reliability with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material provides excellent durability and protection for the GPU, ensuring long-lasting performance

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this GPU can handle power spikes and fluctuations without compromising its functionality

No. of Terminals: 145

Having a high number of terminals allows for complex connections and efficient data transfer within the GPU

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the GPU can operate efficiently even under low power conditions

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this GPU can withstand intense heat levels without overheating or malfunctioning

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the GPU can function in extremely cold environments without any issues

Terminal Position: PERPENDICULAR

The perpendicular terminal position allows for easy installation and connection of the GPU in various devices

Maximum Seated Height: 5.21 mm

The low maximum seated height enables the GPU to be compact and fit into slim devices without any space constraints

Width: 39.751 mm

The width of the GPU is optimized for compatibility with standard motherboard slots and form factors

External Data Bus Width: 32

Having a high external data bus width of 32 bits allows for fast and efficient data transfer between the GPU and other components

Maximum Clock Frequency: 32 MHz

With a high maximum clock frequency, this GPU can process data quickly and efficiently, enhancing overall performance

Length: 39.751 mm

The length of the GPU is designed to fit standard dimensions of electronic devices, ensuring compatibility and ease of installation

Temperature Grade: MILITARY

Being military-grade ensures that the GPU is built to withstand rugged conditions and high-stress environments, making it suitable for demanding applications

Peripheral IC Type: GRAPHICS PROCESSOR

As a graphics processor, this GPU is specialized in handling complex graphical tasks, making it ideal for gaming, video editing, and other graphics-intensive applications

Technology: CMOS

Using CMOS technology allows the GPU to achieve high performance with low power consumption, resulting in energy-efficient operation

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures stable and consistent power delivery to the GPU, preventing voltage fluctuations that could affect performance

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm provides a good balance between compactness and ease of connection, making the GPU versatile for various applications

Maximum Bits Per Pixel: 32

Supporting up to 32 bits per pixel allows the GPU to deliver high-quality graphics and visuals with rich color depth and detail

Technical Specifications

Graphics Processors (GPUs) 5962-9162302MXX attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

Length:

39.751 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT APPLICABLE

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Technology:

CMOS

Temperature Grade:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

39.751 mm

Peripheral IC Type:

Trade Compliance

5962-9162302MXX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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