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OMAP3503DCBBR

Texas Instruments

OMAP3503DCBBR by Texas Instruments

OMAP3503DCBBR by Texas Instruments is a Graphics Processor with 515 terminals in a square package. It operates b/w 0-70°C, suitable for commercial use. Power supplies range from 1.1V to 1.8/3V, making it ideal for various graphics processing applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,440 parts In-Stock

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6,440

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Digiode

USA . 2,296 parts In-Stock

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2,296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$7.370

100+ parts

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247

$7.370

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One Stop Electronics

USA . 538 parts In-Stock

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$19.000

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-

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538

$19.000

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Corohmni

South Africa . 4,974 parts In-Stock

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$42.441

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4,974

$42.441

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Parana Technologies

USA . 1,993 parts In-Stock

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$59.711

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1,993

$59.711

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DigiPath Technology Company

USA . 2,339 parts In-Stock

1+ parts

$65.749

100+ parts

$60.489

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2,339

$65.749

$60.489

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IDEA Electronic Components Group

UK . 2,272 parts In-Stock

1+ parts

$67.091

100+ parts

$63.736

1k+ parts

$60.382

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2,272

$67.091

$63.736

$60.382

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ChromeModa Solutions

Germany . 951 parts In-Stock

1+ parts

$67.091

100+ parts

$55.015

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951

$67.091

$55.015

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Corphita

USA . 1,164 parts In-Stock

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1,164

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Overview

Experience cutting-edge graphics processing power with the OMAP3503DCBBR by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers reliable GPUs that excel in a variety of applications. From gaming to industrial design, this graphics processor offers unmatched performance and efficiency. With a wide range of power supplies and a commercial temperature grade, the OMAP3503DCBBR provides value and versatility for all your graphic processing needs. Elevate your visual experience with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the GPU, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board, saving time and effort during assembly.

Power Supplies (V): 1.1, 1.2, 1.8, 1.8/3

Offers a wide range of compatible power supplies, enabling flexibility in system design and compatibility with different setups.

No. of Terminals: 515

The large number of terminals allows for a high level of connectivity and data transfer, improving overall performance.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enhances signal integrity and electrical performance, leading to optimal GPU functionality.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the GPU can handle intense computational tasks without overheating, ensuring consistent performance under heavy workloads.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance even in colder environments, ensuring the GPU's functionality in various conditions.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this GPU meets industry standards for performance and reliability, making it suitable for a wide range of uses.

Peripheral IC Type: GRAPHICS PROCESSOR

Specifically designed as a graphics processor, this GPU delivers high-quality graphics rendering and processing capabilities for demanding applications such as gaming and multimedia.

Technology: CMOS

Utilizing CMOS technology ensures efficient power consumption and high performance, making the GPU energy-efficient and capable of handling complex graphics tasks.

Terminal Form: BALL

The ball terminal form facilitates a reliable connection to the circuit board, reducing the risk of signal loss or disconnection for stable and uninterrupted GPU performance.

Terminal Pitch: 0.4 mm

With a fine terminal pitch, the GPU can achieve high-density packaging and enable compact design, saving space on the circuit board and supporting miniaturization of devices.

Technical Specifications

Graphics Processors (GPUs) OMAP3503DCBBR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B515

No. of Terminals:

515

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3503DCBBR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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