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OMAP3515BCBB

Texas Instruments

OMAP3515BCBB by Texas Instruments

OMAP3515BCBB by Texas Instruments is a Graphics Processor with 515 terminals in a GRID ARRAY package. It operates at 1.1V, 1.8V, and 3.3V power supplies using CMOS technology. This GPU is ideal for applications requiring high-performance graphics processing in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,817 parts In-Stock

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4,817

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Digiode

USA . 854 parts In-Stock

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854

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Distributors (Availability)

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AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$11.411

100+ parts

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719

$11.411

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One Stop Electronics

USA . 1,458 parts In-Stock

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$14.000

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1,458

$14.000

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Parana Technologies

USA . 1,839 parts In-Stock

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$73.704

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1,839

$73.704

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DigiPath Technology Company

USA . 1,837 parts In-Stock

1+ parts

$81.157

100+ parts

$74.664

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1,837

$81.157

$74.664

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ChromeModa Solutions

Germany . 760 parts In-Stock

1+ parts

$82.813

100+ parts

$67.907

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760

$82.813

$67.907

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IDEA Electronic Components Group

UK . 239 parts In-Stock

1+ parts

$82.813

100+ parts

$78.672

1k+ parts

$74.532

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239

$82.813

$78.672

$74.532

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Corohmni

South Africa . 341 parts In-Stock

1+ parts

$83.260

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341

$83.260

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Corphita

USA . 4,397 parts In-Stock

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4,397

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Overview

Unleash the power of cutting-edge graphics with the OMAP3515BCBB by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers yet again with this high-performance Graphics Processor. Perfect for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers looking to elevate their visual experience. Upgrade your technology game today with the OMAP3515BCBB and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials provide durability and reliability, making this GPU suitable for long-term usage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Power Supplies (V): 1.1,1.8,3.3

Support for multiple power supply voltages gives flexibility in designing systems and optimizing power consumption based on performance requirements.

No. of Terminals: 515

A high number of terminals allow for efficient connectivity and data transfer, enhancing overall performance of the GPU.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package styles offer high density and connectivity, enabling the GPU to handle complex graphics processing tasks effectively.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, improving signal integrity and overall system reliability.

Peripheral IC Type: GRAPHICS PROCESSOR

Being a graphics processor, this IC is specifically designed for handling intensive graphics workloads, making it a perfect choice for high-end gaming and multimedia applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed performance, and compatibility with various digital systems, making the GPU energy-efficient and versatile.

Terminal Form: BALL

Ball terminal form ensures reliable connections and easier soldering during assembly, contributing to the overall durability and quality of the GPU.

Terminal Pitch: 0.4 mm

A fine terminal pitch of 0.4mm allows for high density interconnects, maximizing performance and efficiency of the GPU within a compact form factor.

Technical Specifications

Graphics Processors (GPUs) OMAP3515BCBB attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B515

No. of Terminals:

515

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3515BCBB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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