Loading...

OMAP3503DCBCR

Texas Instruments

OMAP3503DCBCR by Texas Instruments

OMAP3503DCBCR by Texas Instruments is a Graphics Processor with 515 terminals, operating at temperatures from 0 to 70°C. It utilizes CMOS technology and supports power supplies of 1.1V, 1.2V, and more. This GPU is ideal for applications requiring high-performance graphics processing in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,414

-

-

-

-

Vyrian

USA . 2,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,945

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 414 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

414

$3.000

-

-

-

AZTECH Wire

Italy . 362 parts In-Stock

1+ parts

$14.625

100+ parts

-

1k+ parts

-

10k+ parts

-

362

$14.625

-

-

-

Corohmni

South Africa . 73 parts In-Stock

1+ parts

$30.213

100+ parts

-

1k+ parts

-

10k+ parts

-

73

$30.213

-

-

-

Parana Technologies

USA . 1,762 parts In-Stock

1+ parts

$39.432

100+ parts

-

1k+ parts

-

10k+ parts

-

1,762

$39.432

-

-

-

DigiPath Technology Company

USA . 1,350 parts In-Stock

1+ parts

$43.420

100+ parts

$39.946

1k+ parts

-

10k+ parts

-

1,350

$43.420

$39.946

-

-

ChromeModa Solutions

Germany . 3,772 parts In-Stock

1+ parts

$44.306

100+ parts

$36.331

1k+ parts

-

10k+ parts

-

3,772

$44.306

$36.331

-

-

IDEA Electronic Components Group

UK . 1,563 parts In-Stock

1+ parts

$44.306

100+ parts

$42.091

1k+ parts

$39.875

10k+ parts

-

1,563

$44.306

$42.091

$39.875

-

Corphita

USA . 167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

167

-

-

-

-

Overview

Unleash the power of cutting-edge graphics processing with the OMAP3503DCBCR by Texas Instruments. Designed with precision and expertise, this GPU delivers unrivaled performance and reliability for a wide range of applications. From immersive gaming experiences to seamless multimedia playback, this product offers unmatched value and benefits to customers seeking top-tier graphics solutions. Trust in Texas Instruments to provide you with the quality and innovation you need to elevate your visual experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a wide range of applications.

Surface Mount: YES

Ease of installation and space-saving design.

Package Shape: SQUARE

Efficient use of space and compatibility with various system layouts.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

Support for multiple power supply voltages, allowing flexibility in design and power optimization.

No. of Terminals: 515

Sufficient terminals for connecting various components and ensuring smooth operation.

Package Style (Meter): GRID ARRAY, FINE PITCH

High-density packaging for improved performance and reliability.

Maximum Operating Temperature: 70 °C

Suitable for operating in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in colder environments without any issues.

Terminal Position: BOTTOM

Facilitates easy connection to other components and circuit boards.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliability and performance in typical operating conditions.

Peripheral IC Type: GRAPHICS PROCESSOR

Specifically designed for graphics processing, providing high-quality visuals and performance.

Technology: CMOS

Implementation of CMOS technology for low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminal form for reliable connections and easy installation.

Terminal Pitch: 0.5 mm

Fine pitch for increased connection density and improved signal integrity.

Technical Specifications

Graphics Processors (GPUs) OMAP3503DCBCR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B515

No. of Terminals:

515

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3503DCBCR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 8