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SM34020AGBS32

Texas Instruments

SM34020AGBS32 by Texas Instruments

SM34020AGBS32 by Texas Instruments is a 32 MHz graphics processor with 145 terminals. It operates at 5V, with a supply voltage range of 4.5-5.5V. This CMOS technology GPU is ideal for applications requiring high-speed data processing and graphics rendering.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,387 parts In-Stock

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7,387

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Digiode

USA . 934 parts In-Stock

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934

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Distributors (Availability)

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AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$5.238

100+ parts

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790

$5.238

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One Stop Electronics

USA . 1,185 parts In-Stock

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$12.000

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1,185

$12.000

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Corohmni

South Africa . 656 parts In-Stock

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$23.247

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656

$23.247

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Parana Technologies

USA . 1,056 parts In-Stock

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$76.504

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1,056

$76.504

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IDEA Electronic Components Group

UK . 1,705 parts In-Stock

1+ parts

$85.959

100+ parts

$81.661

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$77.363

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1,705

$85.959

$81.661

$77.363

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ChromeModa Solutions

Germany . 840 parts In-Stock

1+ parts

$85.959

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$70.486

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840

$85.959

$70.486

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DigiPath Technology Company

USA . 1,358 parts In-Stock

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$77.501

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$77.501

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Corphita

USA . 1,335 parts In-Stock

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1,335

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Overview

Unleash the power of cutting-edge graphics processing with the SM34020AGBS32 by Texas Instruments. Crafted with precision and expertise, this GPU offers unparalleled performance and reliability for a wide range of applications. Whether you're a gaming enthusiast, a multimedia creator, or a professional designer, this product delivers exceptional value and benefits that will elevate your experience to the next level. Trust in Texas Instruments for superior quality and innovation that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This high-quality material ensures durability and reliability, making the product resistant to heat and mechanical stress.

Maximum Supply Voltage: 5.5 V

With a higher maximum supply voltage, the GPU can operate efficiently without risking damage from spikes in power supply.

Package Shape: SQUARE

The square shape allows for a compact design, making it easier to fit into various electronic devices.

No. of Terminals: 145

Having a high number of terminals allows for more connectivity options and potentially higher processing capabilities.

Maximum Clock Frequency: 32 MHz

Operating at a high clock frequency enables faster processing speeds and smoother graphics rendering.

Peripheral IC Type: GRAPHICS PROCESSOR

Specifically designed for graphics processing, this GPU is optimized for handling complex visual data efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and energy efficiency.

Maximum Bits Per Pixel: 32

Supporting up to 32 bits per pixel allows for high-quality image output with intricate color details and shading.

Technical Specifications

Graphics Processors (GPUs) SM34020AGBS32 attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P145

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA145,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Maximum Supply Current:

265 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

SM34020AGBS32 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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