Loading...

OMAP3503DCUSR

Texas Instruments

OMAP3503DCUSR by Texas Instruments

OMAP3503DCUSR by Texas Instruments is a Graphics Processor with 423 terminals in a square package. It operates b/w 0-70°C, suitable for commercial applications. Power supplies range from 1.1V to 1.8/3V, making it ideal for various graphic processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,507

-

-

-

-

Digiode

USA . 770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

770

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$18.753

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$18.753

-

-

-

One Stop Electronics

USA . 433 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$19.000

-

-

-

Parana Technologies

USA . 1,117 parts In-Stock

1+ parts

$35.672

100+ parts

-

1k+ parts

-

10k+ parts

-

1,117

$35.672

-

-

-

DigiPath Technology Company

USA . 1,632 parts In-Stock

1+ parts

$39.279

100+ parts

$36.137

1k+ parts

-

10k+ parts

-

1,632

$39.279

$36.137

-

-

ChromeModa Solutions

Germany . 5,491 parts In-Stock

1+ parts

$40.081

100+ parts

$32.866

1k+ parts

-

10k+ parts

-

5,491

$40.081

$32.866

-

-

IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$40.081

100+ parts

$38.077

1k+ parts

$36.073

10k+ parts

-

692

$40.081

$38.077

$36.073

-

Corohmni

South Africa . 231 parts In-Stock

1+ parts

$58.565

100+ parts

-

1k+ parts

-

10k+ parts

-

231

$58.565

-

-

-

Corphita

USA . 266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

266

-

-

-

-

Overview

Unlock the power of cutting-edge graphics processing with the OMAP3503DCUSR by Texas Instruments. Crafted with precision and expertise, this GPU offers unparalleled performance and efficiency in a compact square package. Perfect for a wide range of applications, from gaming to automotive displays, this device boasts a multitude of power supplies and a high terminal count to meet your every need. Elevate your projects to new heights with the OMAP3503DCUSR and experience the quality and innovation that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance between durability and cost-effectiveness, making the GPU more affordable without compromising on quality.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components onto a PCB, improving manufacturing processes and reliability of the product.

Package Shape: SQUARE

The square shape of the package provides uniformity and ease of integration into various system designs, enhancing versatility and compatibility.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

The wide range of power supply options allows for flexibility in system configurations and optimizations, catering to different power requirements of diverse applications.

No. of Terminals: 423

The high number of terminals enables efficient signal routing and connectivity, supporting complex graphics processing tasks and data transfer within the GPU.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design enhance signal integrity, reduce crosstalk, and improve electrical performance, ensuring high-speed and reliable operation of the GPU.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures stability and reliability under demanding environmental conditions, making the GPU suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance, enhancing the GPU's versatility and usability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, improving overall system design efficiency and manufacturability.

Temperature Grade: COMMERCIAL

The commercial temperature grade is suitable for standard operating conditions in commercial applications, offering a balance between performance and cost-effectiveness.

Peripheral IC Type: GRAPHICS PROCESSOR

The graphics processor type indicates specialized capabilities for high-performance graphics rendering, making the GPU ideal for gaming, multimedia, and professional graphics applications.

Technology: CMOS

The CMOS technology provides low power consumption, high speed, and compatibility with modern digital systems, enhancing the energy efficiency and overall performance of the GPU.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections, easy assembly, and robust mechanical support, ensuring long-term operational reliability and durability of the GPU.

Terminal Pitch: 0.635 mm

The fine terminal pitch allows for high-density packaging and miniaturization, enabling compact and space-saving designs in electronic devices utilizing the GPU.

Technical Specifications

Graphics Processors (GPUs) OMAP3503DCUSR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B423

No. of Terminals:

423

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3503DCUSR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 8