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OMAP3515BCUS

Texas Instruments

OMAP3515BCUS by Texas Instruments

OMAP3515BCUS by Texas Instruments is a Graphics Processor with 423 terminals in a GRID ARRAY package. It operates at 1.1V, 1.8V, and 3.3V power supplies using CMOS technology. This GPU is commonly used in applications requiring high-performance graphics processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,614 parts In-Stock

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4,614

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Vyrian

USA . 3,183 parts In-Stock

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3,183

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 556 parts In-Stock

1+ parts

$7.000

100+ parts

-

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556

$7.000

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AZTECH Wire

Italy . 70 parts In-Stock

1+ parts

$9.038

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70

$9.038

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Parana Technologies

USA . 1,337 parts In-Stock

1+ parts

$64.651

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1,337

$64.651

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DigiPath Technology Company

USA . 207 parts In-Stock

1+ parts

$71.189

100+ parts

$65.494

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207

$71.189

$65.494

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ChromeModa Solutions

Germany . 6,621 parts In-Stock

1+ parts

$72.642

100+ parts

$59.566

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6,621

$72.642

$59.566

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IDEA Electronic Components Group

UK . 2,270 parts In-Stock

1+ parts

$72.642

100+ parts

$69.010

1k+ parts

$65.378

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2,270

$72.642

$69.010

$65.378

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Corohmni

South Africa . 3,215 parts In-Stock

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$77.948

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3,215

$77.948

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Corphita

USA . 77 parts In-Stock

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77

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Overview

Experience the power of cutting-edge graphics processing with the OMAP3515BCUS by Texas Instruments. Built with precision and expertise, this GPU offers unparalleled performance and reliability in a sleek package. Ideal for a wide range of applications, from gaming to virtual reality, this product delivers exceptional value and benefits to customers looking for top-of-the-line graphics capabilities. Trust Texas Instruments for quality and innovation in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the graphics processor more portable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on the circuit board.

Package Shape: SQUARE

The square shape of the package provides a compact design that can fit efficiently in electronic devices.

Power Supplies (V): 1.1, 1.8, 3.3

Support for multiple power supply voltages ensures compatibility with various systems and devices.

No. of Terminals: 423

A higher number of terminals allows for more connections and functionalities within the graphics processor.

Package Style: GRID ARRAY, FINE PITCH

The grid array and fine pitch design enable high-performance and efficient signal transmission in the graphics processor.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and facilitates easier soldering during assembly.

Peripheral IC Type: GRAPHICS PROCESSOR

Being specifically designed as a graphics processor ensures optimal visual performance and rendering capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability in the graphics processing unit.

Terminal Form: BALL

Ball-shaped terminals provide a secure connection and excellent electrical conductivity within the graphics processor.

Terminal Pitch: 0.635 mm

A small terminal pitch allows for tighter packing density, enhancing overall performance and efficiency of the graphics processor.

Technical Specifications

Graphics Processors (GPUs) OMAP3515BCUS attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B423

No. of Terminals:

423

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3515BCUS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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