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5962-9162304MYX

Texas Instruments

5962-9162304MYX by Texas Instruments

5962-9162304MYX by Texas Instruments is a military-grade graphics processor with CMOS technology. It operates b/w -55 to 125 °C, has a clock frequency of 40 MHz, and supports up to 32 bits per pixel. Ideal for applications requiring high-performance GPUs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,638 parts In-Stock

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Digiode

USA . 3,679 parts In-Stock

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3,679

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Distributors (Availability)

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AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$5.946

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524

$5.946

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One Stop Electronics

USA . 1,180 parts In-Stock

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$34.000

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$34.000

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Corohmni

South Africa . 9 parts In-Stock

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$34.707

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9

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Parana Technologies

USA . 700 parts In-Stock

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$63.799

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700

$63.799

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DigiPath Technology Company

USA . 2,194 parts In-Stock

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$70.250

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$70.250

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Native Components

USA . 685 parts In-Stock

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$70.825

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$67.992

685

$70.825

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$67.992

ChromeModa Solutions

Germany . 6,728 parts In-Stock

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$71.684

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$58.781

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$58.781

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IDEA Electronic Components Group

UK . 681 parts In-Stock

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$71.684

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$68.100

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$64.516

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681

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$64.516

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Northwest PG Solutions

USA . 2,018 parts In-Stock

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$77.907

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Corphita

USA . 2,902 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the 5962-9162304MYX by Texas Instruments, a high-quality Graphics Processor (GPU) designed to elevate your visual experiences to new heights. With a MIL-STD-883 Class B screening level and a temperature grade of MILITARY, this GPU delivers unparalleled performance and reliability in extreme conditions. Whether you're a gaming enthusiast, a content creator, or a professional designer, this GPU offers unmatched value, benefits, and advantages that will take your work or play to the next level. Elevate your graphics with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials in the package body increases durability and reliability, making this GPU suitable for rugged environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for stable performance even under heavy workloads or demanding applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the GPU can withstand extended use without overheating or performance degradation.

Technology: CMOS

The CMOS technology used in this GPU offers low power consumption, making it energy-efficient and suitable for devices requiring long battery life.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency, this GPU can efficiently process graphics data and deliver smooth visuals in high-performance applications.

Technical Specifications

Graphics Processors (GPUs) 5962-9162304MYX attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

JESD-30 Code:

S-CQFP-F132

Length:

24.065 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

132

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.065 mm

Peripheral IC Type:

Trade Compliance

5962-9162304MYX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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