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5962-9162302MXA

Texas Instruments

5962-9162302MXA by Texas Instruments

The Texas Instruments 5962-9162302MXA is a military-grade graphics processor with 32-bit external data bus width and max clock frequency of 32 MHz. It operates b/w -55 to 125 °C, suitable for high-performance applications requiring high-speed graphics processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,413 parts In-Stock

1+ parts

-

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9,413

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Digiode

USA . 3,565 parts In-Stock

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3,565

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Distributors (Availability)

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One Stop Electronics

USA . 714 parts In-Stock

1+ parts

$2.000

100+ parts

-

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714

$2.000

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AZTECH Wire

Italy . 783 parts In-Stock

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$9.485

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-

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783

$9.485

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Corohmni

South Africa . 168 parts In-Stock

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$16.724

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168

$16.724

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Parana Technologies

USA . 1,496 parts In-Stock

1+ parts

$17.114

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-

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$17.328

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1,496

$17.114

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$17.328

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DigiPath Technology Company

USA . 1,004 parts In-Stock

1+ parts

$18.844

100+ parts

$17.337

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-

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1,004

$18.844

$17.337

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ChromeModa Solutions

Germany . 4,058 parts In-Stock

1+ parts

$19.229

100+ parts

$15.768

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4,058

$19.229

$15.768

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

1+ parts

$19.229

100+ parts

$18.268

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$17.306

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1,155

$19.229

$18.268

$17.306

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Northwest PG Solutions

USA . 1,848 parts In-Stock

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1,848

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Native Components

USA . 185 parts In-Stock

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185

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Corphita

USA . 52 parts In-Stock

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52

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Overview

Unleash the power of cutting-edge graphics processing with the 5962-9162302MXA by Texas Instruments. Crafted with top-quality materials and precision engineering, this GPU offers unparalleled performance and reliability in a compact package. Perfect for a wide range of applications, from gaming to medical imaging, this military-grade component can handle any task with ease. Elevate your projects to the next level with the unmatched value and benefits of the 5962-9162302MXA.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material ensures durability and enhanced thermal performance, making the product reliable for long-term use.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this GPU can handle power fluctuations without risking damage, ensuring stable performance.

No. of Terminals: 145

The high number of terminals allows for multiple connections and versatility in usage, making it suitable for various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature indicates that this GPU can withstand heat-intensive tasks without overheating, ensuring consistent performance.

Maximum Clock Frequency: 32 MHz

With a high clock frequency, this GPU can deliver fast processing speeds, making it suitable for high-demand applications such as gaming or graphic design.

Technical Specifications

Graphics Processors (GPUs) 5962-9162302MXA attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

Length:

39.751 mm

Maximum Bits Per Pixel:

32

No. of Terminals:

145

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT APPLICABLE

Qualification:

Not Qualified

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Technology:

CMOS

Temperature Grade:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

39.751 mm

Peripheral IC Type:

Trade Compliance

5962-9162302MXA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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