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OMAP3515DCUSR

Texas Instruments

OMAP3515DCUSR by Texas Instruments

OMAP3515DCUSR by Texas Instruments is a Graphics Processor with 423 terminals, operating at temperatures from 0 to 70°C. It utilizes CMOS technology and supports power supplies of 1.1V, 1.2V, and more for various applications requiring high-performance graphics processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,919 parts In-Stock

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4,919

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Digiode

USA . 1,279 parts In-Stock

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1,279

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$11.793

100+ parts

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256

$11.793

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One Stop Electronics

USA . 476 parts In-Stock

1+ parts

$23.000

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476

$23.000

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Corohmni

South Africa . 866 parts In-Stock

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$39.921

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866

$39.921

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Parana Technologies

USA . 565 parts In-Stock

1+ parts

$54.578

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565

$54.578

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ChromeModa Solutions

Germany . 2,968 parts In-Stock

1+ parts

$61.324

100+ parts

$50.286

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2,968

$61.324

$50.286

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IDEA Electronic Components Group

UK . 538 parts In-Stock

1+ parts

$61.324

100+ parts

$58.258

1k+ parts

$55.192

10k+ parts

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538

$61.324

$58.258

$55.192

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Corphita

USA . 3,076 parts In-Stock

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3,076

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DigiPath Technology Company

USA . 1,606 parts In-Stock

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$55.290

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1,606

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$55.290

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Overview

Unleash the power of cutting-edge graphics technology with the OMAP3515DCUSR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality GPUs that are perfect for a wide range of applications. Whether you're looking to enhance your gaming experience, boost your productivity with advanced graphics capabilities, or streamline your visual processing tasks, this product offers unmatched value and benefits. Say goodbye to lagging visuals and hello to seamless performance with the OMAP3515DCUSR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and provides protection to the internal components of the GPU, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the GPU onto the circuit board, saving space and enabling streamlined manufacturing processes.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

The wide range of power supply options ensures compatibility with various systems, offering flexibility in terms of power requirements.

No. of Terminals: 423

The high number of terminals enables seamless connectivity and communication within the GPU, contributing to its overall performance and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enhance the electrical connections and signal integrity, resulting in improved efficiency and data transmission speed.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this GPU can withstand high temperatures without compromising its performance, ensuring reliability under various operating conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this GPU suitable for a wide range of environments and applications, offering versatility and resilience.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and maintenance of the GPU, simplifying the overall system integration process.

Temperature Grade: COMMERCIAL

Designed for commercial use, this GPU meets the required standards and specifications for business and consumer applications, ensuring consistent performance and reliability.

Peripheral IC Type: GRAPHICS PROCESSOR

As a graphics processor, this GPU is optimized for handling complex graphics and rendering tasks, delivering high-quality visuals and smooth performance in graphic-intensive applications.

Technology: CMOS

Utilizing CMOS technology, this GPU offers low power consumption and high speed operation, making it energy-efficient and capable of handling demanding computing tasks effectively.

Terminal Form: BALL

The ball terminal form provides secure connections and improves thermal conductivity, enhancing the overall reliability and performance of the GPU.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635 mm, this GPU supports precise and compact component placement, optimizing space utilization and ensuring efficient signal transmission.

Technical Specifications

Graphics Processors (GPUs) OMAP3515DCUSR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B423

No. of Terminals:

423

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3515DCUSR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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