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OMAP3503DCBBAR

Texas Instruments

OMAP3503DCBBAR by Texas Instruments

OMAP3503DCBBAR by Texas Instruments is a Graphics Processor with 515 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. The CMOS technology and fine pitch grid array make it ideal for graphics processing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,589 parts In-Stock

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7,589

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Digiode

USA . 74 parts In-Stock

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74

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Distributors (Availability)

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AZTECH Wire

Italy . 767 parts In-Stock

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$6.230

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767

$6.230

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Parana Technologies

USA . 1,040 parts In-Stock

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$32.280

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$103.603

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$32.280

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One Stop Electronics

USA . 1,296 parts In-Stock

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$34.000

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1,296

$34.000

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ChromeModa Solutions

Germany . 5,817 parts In-Stock

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$36.270

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$29.741

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5,817

$36.270

$29.741

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IDEA Electronic Components Group

UK . 1,778 parts In-Stock

1+ parts

$36.270

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$34.456

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$32.643

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1,778

$36.270

$34.456

$32.643

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Corohmni

South Africa . 4,911 parts In-Stock

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$37.892

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4,911

$37.892

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Corphita

USA . 988 parts In-Stock

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DigiPath Technology Company

USA . 690 parts In-Stock

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$32.701

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690

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$32.701

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Overview

Unleash the power of cutting-edge graphics processing with the OMAP3503DCBBAR by Texas Instruments. Crafted with precision and expertise, this GPU exemplifies the pinnacle of quality and reliability that TI is renowned for. Ideal for a wide range of applications, from gaming to multimedia content creation, this product delivers unparalleled performance and efficiency. Elevate your projects with the value, benefits, and advantages that only the OMAP3503DCBBAR can provide. Experience innovation at its finest with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the GPU, making it a suitable choice for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation and integration into various electronic devices, enhancing flexibility.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

Support for multiple power supply voltages ensures compatibility with different system configurations, improving versatility.

No. of Terminals: 515

High number of terminals enables efficient connectivity and data transfer, enhancing performance of the GPU.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance of the GPU, making it user-friendly.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures stable performance even under extended usage in demanding conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows the GPU to function reliably in cold environments, expanding its usability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robustness and durability of the GPU, making it suitable for industrial applications.

Peripheral IC Type: GRAPHICS PROCESSOR

Specifically designed as a graphics processor, this GPU provides optimized performance for graphics-intensive tasks such as gaming and video editing.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, contributing to energy efficiency and improved overall performance.

Terminal Form: BALL

Ball terminal form ensures secure and reliable connections, minimizing the risk of data loss or connection issues.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm facilitates high-density packaging and precise connection, allowing for compact and efficient design of the GPU.

Technical Specifications

Graphics Processors (GPUs) OMAP3503DCBBAR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B515

No. of Terminals:

515

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

OMAP3503DCBBAR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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