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TMS34010-40FNR

Texas Instruments

TMS34010-40FNR by Texas Instruments

TMS34010-40FNR by Texas Instruments is a 16-bit graphics processor with max clock freq of 40MHz. It operates b/w 0-70°C, suitable for commercial applications. With a supply voltage range of 4.75-5.25V, it's ideal for high-performance graphic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,698 parts In-Stock

1+ parts

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5,698

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Digiode

USA . 3,876 parts In-Stock

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3,876

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$12.941

100+ parts

-

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256

$12.941

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One Stop Electronics

USA . 1,460 parts In-Stock

1+ parts

$23.000

100+ parts

-

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1,460

$23.000

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Corohmni

South Africa . 3,216 parts In-Stock

1+ parts

$27.312

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3,216

$27.312

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Parana Technologies

USA . 190 parts In-Stock

1+ parts

$34.177

100+ parts

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1k+ parts

$144.087

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190

$34.177

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$144.087

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DigiPath Technology Company

USA . 1,427 parts In-Stock

1+ parts

$37.633

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1,427

$37.633

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IDEA Electronic Components Group

UK . 1,618 parts In-Stock

1+ parts

$38.401

100+ parts

$36.481

1k+ parts

$34.561

10k+ parts

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1,618

$38.401

$36.481

$34.561

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ChromeModa Solutions

Germany . 355 parts In-Stock

1+ parts

$38.401

100+ parts

$31.489

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355

$38.401

$31.489

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Corphita

USA . 3,151 parts In-Stock

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3,151

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Overview

Enhance your graphics processing capabilities with the TMS34010-40FNR by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers a top-of-the-line graphics processor that offers unparalleled performance and reliability. Perfect for a wide range of applications in the gaming, multimedia, and industrial sectors, this chip carrier package ensures seamless integration and optimal functionality. Upgrade your system today and experience the benefits of superior graphics processing power with the TMS34010-40FNR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material ensures durability and protection for the internal components of the GPU, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for efficient power delivery to the GPU, enabling it to handle demanding graphics processing tasks effectively.

Terminal Position: QUAD

The quad terminal position design facilitates easy integration and soldering of the GPU onto the circuit board, simplifying the assembly process for manufacturers.

Technology: CMOS

The CMOS technology used in the GPU ensures low power consumption and high performance, making it an energy-efficient and reliable graphics processing solution.

Technical Specifications

Graphics Processors (GPUs) TMS34010-40FNR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.2062 mm

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.2062 mm

Peripheral IC Type:

Trade Compliance

TMS34010-40FNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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