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TMS34010-50FNR

Texas Instruments

TMS34010-50FNR by Texas Instruments

TMS34010-50FNR by Texas Instruments is a 16-bit graphics processor with max clock freq of 50 MHz. It operates b/w 0-70°C, with supply voltage range of 4.75-5.25 V. Ideal for applications requiring high-speed graphics processing in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,356 parts In-Stock

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6,356

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Digiode

USA . 4,336 parts In-Stock

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4,336

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 522 parts In-Stock

1+ parts

$5.018

100+ parts

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522

$5.018

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One Stop Electronics

USA . 1,385 parts In-Stock

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$27.000

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1,385

$27.000

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Parana Technologies

USA . 1,779 parts In-Stock

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$56.803

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1,779

$56.803

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DigiPath Technology Company

USA . 604 parts In-Stock

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$62.548

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604

$62.548

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ChromeModa Solutions

Germany . 1,741 parts In-Stock

1+ parts

$63.824

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$52.336

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1,741

$63.824

$52.336

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IDEA Electronic Components Group

UK . 1,733 parts In-Stock

1+ parts

$63.824

100+ parts

$60.633

1k+ parts

$57.442

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1,733

$63.824

$60.633

$57.442

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Corohmni

South Africa . 367 parts In-Stock

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$84.679

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367

$84.679

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Corphita

USA . 3,851 parts In-Stock

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3,851

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Overview

Experience top-of-the-line graphics processing power with the TMS34010-50FNR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions for all your GPU needs. Whether you're creating stunning visual effects, enhancing gaming experiences, or accelerating data processing, this graphics processor exceeds expectations. With its advanced technology and reliable performance, the TMS34010-50FNR offers unmatched value and benefits to customers looking for high-quality solutions. Elevate your projects with this exceptional product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronics packaging due to its durability and resistance to heat, making the product reliable in various operating conditions.

Maximum Supply Voltage: 5.25 V

Higher supply voltage allows for better performance and efficiency, making this GPU suitable for demanding graphics applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this GPU can withstand prolonged use without overheating, ensuring long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and performance of the GPU.

Maximum Clock Frequency: 50 MHz

A high clock frequency enables faster processing of graphics data, delivering smooth and high-quality visuals.

Technical Specifications

Graphics Processors (GPUs) TMS34010-50FNR attributes and parameters. Explore more Graphics Processors (GPUs) devices from Texas Instruments

Specs

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.2062 mm

Maximum Bits Per Pixel:

16

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.2062 mm

Peripheral IC Type:

Trade Compliance

TMS34010-50FNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.3

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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